MOS transistor fixing structure and mounting method thereof

Abstract

The invention discloses an MOS transistor fixing structure and a mounting method thereof. The fixing structure comprises an MOS transistor (3), a radiating fin (5) and an elastic piece (2) which comprises a body part (21). The body part (21) is provided with an outward protrusion and a clamping part (22) which can carry out elastic deforming. The elastic piece (2) and the radiating fin (5) are connected through screws (1), and the MOS transistor (3) is clamped between the clamping part (22) and the radiating fin (5). Extending parts (23) which extend outwards are arranged on the two sides of the body part (21). Through holes which can be used for the screws (1) to penetrate through are formed in the extending parts (23). The screws (1) are in thread connection with a screw base (51) on the radiating fin (5). According to the positions of the extending parts (23), the screws (1) are not in contact with the MOS transistor (3), a fixing mode is simple, high efficiency is achieved, cost is low, and the MOS transistor fixing structure is especially practical for a structure where the MOS transistor (3) is used in a large area.

Description

technical field [0001] The invention belongs to the technical field of MOS tubes, in particular to a MOS tube fixing structure and an installation method thereof. Background technique [0002] With the rapid development of industry, the fields that need to be controlled by MOS are becoming more and more extensive, and the fixing methods of MOS tubes (metal-oxide-semiconductor field effect transistors) are also various. Ordinary MOS tubes use screws, patches, etc., and then contact the heat sink, [0003] In the process of realizing the present invention, the inventors found that there are at least the following problems in the prior art: in general, screw fixing requires a screw for each MOS tube, the process is complicated, and there is a risk of short circuit; The MOS tube is pasted on the aluminum substrate, and then pasted on the heat sink through the aluminum substrate. This structure has a high cost of use, more processes, and very high process requirements. Content...

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Problems solved by technology

[0003] In the process of realizing the present invention, the inventors found that there are at least the following problems in the prior art: in general, screw fixing requires a screw for each MOS tube, the process is complicated, and there is a risk of short circuit; The MOS tube is pasted on the aluminum substrate, and then pasted on the heat sink through the aluminum substrate. This structure has high cost and many processes, and the process requirements are also very high.

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