OLED device and encapsulation method and display device thereof

A packaging method and device technology, which is applied in the direction of electric solid devices, semiconductor devices, semiconductor/solid device manufacturing, etc., can solve problems such as cracks and damages, achieve moderate pressure difference inside and outside the box, ensure sealing protection, improve Bad effect of cracks and breakage

Active Publication Date: 2015-03-25
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to the brittle material of the glass glue, it is easy to cause cracks and damage under the extrusion of the large pressure difference between the inner and outer boxes of the above-mentioned box.

Method used

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  • OLED device and encapsulation method and display device thereof
  • OLED device and encapsulation method and display device thereof
  • OLED device and encapsulation method and display device thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] This embodiment provides a packaging method for an OLED device, such as Figure 1-Figure 8 shown, including:

[0044] Step S1: Open a through hole 4 on the cover plate 1 between the area for forming the glass glue 2 and the area for coating the UV glue 3, and form the glass glue 2 and the UV glue 3 on the same surface of the cover plate 1. Coating UV glue 3, UV glue 3 is coated on the periphery of glass glue 2 (as figure 1 ).

[0045] The through holes 4 opened in this step include a plurality of through holes 4 evenly distributed in the area between the UV glue 3 and the glass glue 2 . The provision of a plurality of through holes 4 is beneficial to make the pressure in the box formed by the cover plate 1 and the back plate 5 to reach the second pressure quickly in the subsequent step S5. Wherein, the width of the distribution area of ​​the through holes 4 is less than 1mm. The diameter of the through hole 4 is in the range of 0.1-0.2mm. The width and diameter of ...

Embodiment 2

[0064] This embodiment provides an OLED device, which is packaged using the packaging method in Embodiment 1.

[0065] The OLED device is packaged by using the packaging method in Example 1, which improves the defect that the glass glue used for OLED device packaging is easily squeezed to cause cracks and damage under the action of the pressure difference between the box and the outside of the box, thereby improving the OLED device. encapsulation effect.

Embodiment 3

[0067] This embodiment provides a display device, including the OLED device in Embodiment 2.

[0068] By adopting the OLED device in Embodiment 2, not only the encapsulation effect of the display device is improved, but also the encapsulation quality of the display device is improved.

[0069] The display device provided by the present invention can be any product or component with OLED display function, such as OLED panel, OLED TV, OLED display, OLED mobile phone, OLED navigator, and the like.

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Abstract

The invention provides an OLED device and an encapsulation method and a display device thereof. The encapsulation method comprises the steps of forming through holes in an area, between an area for forming glass cement and an area coated with UV adhesive, of a cover plate; adjusting the intensity of pressure in a paired box chamber into first intensity of pressure; folding a back plate and the cover plate on a base table in the paired box chamber; enabling the first intensity of pressure to be lower than the barometric pressure; regulating the intensity of pressure in the paired box chamber to the barometric pressure; curing the UV adhesive; regulating the intensity of pressure in the paired chamber to be second intensity of pressure, separating the cover plate from the base table, and enabling the second intensity of pressure to be lower than the barometric pressure and higher than the first intensity of pressure; encapsulating the through holes in the cover plate; sintering the glass cement. By means of the encapsulation method, the UV adhesive can be tightly compacted before the glass cement is sintered, and broken lines and bonding defects of the UV adhesive are avoided. Meanwhile, the intensity of pressure inside and outside a box of the sealed OLED device is made appropriate, so that the defects of cracks and damage caused by the fact that the glass cement are easily extruded under the effect of the difference of the intensity of pressure inside and outside the box are effectively overcome.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an OLED device, a packaging method thereof, and a display device. Background technique [0002] OLED (Organic Light-Emitting Diode organic electrical laser display) devices have many outstanding properties such as ultra-thin, low cost, low power consumption, wide viewing angle, full curing, self-illumination, low driving voltage and flexible display. OLED will become A promising new generation of flat panel display technology. [0003] An OLED device is a display device that drives a luminescent material to emit light autonomously by an electric current. Since luminescent materials are very sensitive to temperature, air, and water, good packaging is crucial to the lifespan and picture quality of OLED devices. [0004] The existing mature packaging technology for small-sized OLED devices is glass glue packaging. The main packaging process steps are: 1. Screen printing g...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/56H01L51/50H01L51/52H01L27/32
CPCH10K50/8426H10K71/00
Inventor 肖昂
Owner BOE TECH GRP CO LTD
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