Method for preparing water cooling plate

A technology of water-cooled heat dissipation plate and base plate, which is applied in the field of heat dissipation. It can solve the problems of rough wall surface of the channel, poor heat dissipation effect of water-cooled heat dissipation plate, and easy scaling, so as to avoid accumulation, ensure flatness, and ensure heat exchange.

Active Publication Date: 2015-04-01
DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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  • Abstract
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AI Technical Summary

Problems solved by technology

[0003] The invention mainly solves the technical problems of poor heat dissipation effect of the existing water-cooled heat dissipation plate, rough wall surface of the channel and easy fouling

Method used

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  • Method for preparing water cooling plate
  • Method for preparing water cooling plate
  • Method for preparing water cooling plate

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Embodiment Construction

[0016] The following will clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0017] Please also see figure 1 with figure 2 ,in figure 1 is a schematic structural view of a water-cooled heat sink prepared according to the method for preparing a water-cooled heat sink of the present invention, figure 2 yes figure 1 The three-dimensional exploded view of the water-cooled heat sink shown. The water-cooled heat dissipation plate 100 includes a base plate 1 , a copper pipe 2 , a filling body 3 , a water inlet joint 4 and a water outlet joint 5 . The substrate 1 includes a groove 11 and a plu...

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Abstract

The invention provides a method for preparing a water cooling plate. The method comprises the steps that a substrate is provided, and a groove is milled in the surface of the substrate; a copper tube is provided, and the copper tube is embedded in the groove; a filling body is provided, the filling body is poured into the groove under a heating condition, and the groove is full of the filling body; the filling body is mechanically ground, and the surface of the substrate is kept flat; a water inlet joint and a water outlet joint are mounted at the two ends of the copper tube respectively. According to the method for preparing the water cooling plate, the copper tube is embedded in the substrate to be used as a cooling liquid channel, and the copper tube can not be likely to be in chemical reaction with cooling liquid, so that substances with the very low thermal conductivity are prevented from being accumulated on the wall face of a pipeline, the heat exchange between the cooling plate and the cooling liquid is guaranteed, the good cooling effect can be kept for a long time, the reliability of the water cooling plate is improved, the filling body is poured in the groove, the copper tube can be fixed, and the flatness of the surface of the substrate can also be guaranteed.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a method for preparing a water-cooled heat dissipation plate. Background technique [0002] The traditional water-cooled heat sink uses the hole drilled in the middle of the aluminum plate as the coolant circulation channel, and the circulation of the coolant in the hole is used to take away the heat. However, due to the relatively active chemical properties of aluminum, when high temperature or acidic water passes through, the inner wall of the hole is prone to chemical corrosion. reaction, a layer of material with extremely low thermal conductivity is formed on the surface of the channel wall, which seriously affects the heat conduction effect of the heat sink, and the use of drilling as a heat dissipation channel may easily cause the wall surface of the channel to be rough, and the substance in the cooling liquid is easy to Scale adheres to the wall of the channel. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K7/20
Inventor 郑国胜蔡志浩杨毅
Owner DONGGUAN WERY DOOD CIRCUIT BOARD EQUIP
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