Low-temperature ceramic bond and preparation method thereof
A ceramic bond and low temperature technology, applied in the field of low temperature ceramic bond and its preparation, to achieve the effect of high thermal expansion coefficient, good fluidity and low refractoriness
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Embodiment 1
[0010] A low-temperature vitrified bond consisting of the following weight fractions: SiO 2 36 copies, B 2 o 3 23 parts, Fe 2 o 3 30 parts, CaO 2 parts, Li 2 CO 3 7 parts, KNO 3 3 parts, Na 2 o6.
[0011] Fully mix the above materials in a high-energy ball mill, fully mix all raw materials in a ball mill, add water, ball mill for 5 hours, then stand for 2 hours, pour out the water, dry at 90°C, ball mill and sieve to prepare A vitrified bond is obtained.
Embodiment 2
[0013] A low-temperature vitrified bond consisting of the following weight fractions: SiO 2 40 copies, B 2 o 3 28 parts, Fe 2 o 3 35 parts, CaO 6 parts, Li 2 CO 3 8 servings, KNO 3 4 parts, Na 2 O 7 servings.
[0014] Fully mix all raw materials in a ball mill, add water, ball mill for 8 hours, then stand for 2 hours, pour out the water, dry at 90°C, ball mill and sieve to prepare vitrified bond.
Embodiment 3
[0016] A low-temperature vitrified bond consisting of the following weight fractions: SiO 2 45 copies, B 2 o 3 33 parts, Fe 2 o 3 40 parts, CaO 8 parts, Li 2 CO 3 10 parts, KNO 3 5 parts, Na 2 O 9 servings.
[0017] Fully mix all raw materials in a ball mill, add water, ball mill for 10 hours, then stand for 1 hour, pour out the water, dry at 100°C, ball mill and sieve to prepare vitrified bond.
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