Formation method of digital micro display

Abstract

Disclosed is a formation method of a digital micro display. The method includes: providing a substrate with a micro display control circuit formed thereon; forming a first sacrificial layer on the substrate; forming a conducting material layer, a dielectric material layer on the conducting material layer and a pattern photoresist layer located on the dielectric material layer on the first sacrificial layer; by taking the pattern photoresist layer as a mask, performing dry etching on the dielectric material layer and the conducting material layer so as to form a hinge; after the hinge is formed, removing part of the pattern photoresist layer by means of wet etching; performing anisotropic dry etching on the rest part of the pattern photoresist layer. The whole pattern photoresist layer is removed cleanly, meanwhile the first sacrificial layer under the hinge cannot be corroded so as to avoid collapse of the hinge, the dielectric layer of the hinge is protected against etching, and the plasma damage to the substrate is reduced as well.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for forming a digital micromirror device. Background technique [0002] Digital Micro Display (DMD) is a new type of all-digital flat panel display device, which integrates a reflective micromirror array and CMOS SRAM on the same chip. Since the reflective micromirror occupies most of the display area of ​​the digital micromirror device unit, a system with high brightness and high image quality can be produced. [0003] figure 1 It is an exploded view of the three-dimensional structure of an existing digital micromirror device, such as figure 1 As shown, the digital micromirror device includes: a substrate 1, a micromirror device control circuit is formed on the substrate 1; a digital micromirror array on the substrate 1, and each digital micromirror in the digital micromirror array includes: through two A hinge (hinge) 2 above the base 1 is supported by a firs...

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Problems solved by technology

[0013] The problem to be solved by the present invention is: the existing digital micromirror device formation method cannot completely remove the patterned photoresist layer above the hinge

[0014] Another problem to be solved by the present invention is: the existing digital micromirror device formation method cannot completely remove the patterned photoresist layer above the fixed electrode

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