Formation method of digital micromirror device

Abstract

A method for forming a digital micromirror device, comprising: providing a substrate formed with a micromirror device control circuit; forming a first sacrificial layer on the substrate; forming a conductive material layer on the first sacrificial layer, and a medium on the conductive material layer The material layer and the patterned photoresist layer on the dielectric material layer; using the patterned photoresist layer as a mask, the dielectric material layer and the conductive material layer are dry-etched to form a hinge; after the hinge is formed, A wet etching method is used to remove part of the patterned photoresist layer; anisotropic dry etching is performed on the remaining part of the patterned photoresist layer. While ensuring that the entire patterned photoresist layer is cleanly removed, the first sacrificial layer under the hinge will not be corroded so that the hinge collapse will not occur, and the dielectric layer in the hinge will not be etched. The plasma damage to the substrate is reduced.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a method for forming a digital micromirror device. Background technique [0002] Digital Micro Display (DMD) is a new type of all-digital flat panel display device, which integrates a reflective micromirror array and CMOS SRAM on the same chip. Since the reflective micromirror occupies most of the display area of ​​the digital micromirror device unit, a system with high brightness and high image quality can be produced. [0003] figure 1 It is an exploded view of the three-dimensional structure of an existing digital micromirror device, such as figure 1 As shown, the digital micromirror device includes: a substrate 1, a micromirror device control circuit is formed on the substrate 1; a digital micromirror array on the substrate 1, and each digital micromirror in the digital micromirror array includes: through two A hinge (hinge) 2 above the base 1 is supported by a firs...

AI Technical Summary

Problems solved by technology

[0013] The problem to be solved by the present invention is: the existing digital micromirror device formation method cannot completely remove the patterned photoresist layer above the hinge

[0014] Another problem to be solved by the present invention is: the existing digital micromirror device formation method cannot completely remove the patterned photoresist layer above the fixed electrode

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