Ring removing method of Taiko thinning process
A technology, the technology of Taiko, which is applied in the ring removal field of the Taiko thinning process, can solve the problems of edge chipping, wafer breaking, fragmentation, etc.
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[0026] Such as figure 1 Shown is a flowchart of a method according to an embodiment of the present invention; Figure 2A to Figure 2D What is shown is a schematic diagram of the wafer structure in each step of the method of the embodiment of the present invention. The ring removing method of the Taiko thinning process in the embodiment of the present invention includes the following steps:
[0027] Step one, such as Figure 2A As shown, the back surface of the wafer is thinned using the Tai drum thinning process, the middle portion 1a of the wafer is thinned to the required thickness, and the edge portion of the wafer is not thinned to form a support ring 1b.
[0028] The middle portion 1a of the wafer is used to form integrated circuit devices. Preferably, the thickness of the middle portion 1a of the wafer after back-thinning is 25 micrometers to 200 micrometers, and the specific thickness can be adjusted according to the requirements of the integrated circuit device.
[0029] The...
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