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LED (light emitting diode) packaging structure with high heat-dissipation capability

A technology of LED packaging and high heat dissipation, applied in electrical components, circuits, semiconductor devices, etc., can solve the problems affecting the stable operation of LEDs, large light decay of LED chips, and short service life, and achieve good heat dissipation effect, uniform light emission, and heat dissipation. quick effect

Inactive Publication Date: 2015-04-15
CHONGQING XINTIANYANG LIGHTING TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0002] With the continuous development of LED technology, LED packaging technology has become increasingly mature, but the existing LED packaging structure products generally have the problems of large light attenuation and short service life, especially for high-power LED packaging structure products. Multiple LED chips, the LED chips are concentrated, the heat cannot be dissipated immediately, which affects the stable operation of the LED, resulting in a large light decay of the LED chip and a severely shortened lifespan. The greater the power, the more unstable the product

Method used

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  • LED (light emitting diode) packaging structure with high heat-dissipation capability
  • LED (light emitting diode) packaging structure with high heat-dissipation capability
  • LED (light emitting diode) packaging structure with high heat-dissipation capability

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Embodiment 1

[0018] Such as figure 1 As shown, a high heat dissipation LED packaging structure includes a copper substrate 1 and a white light chip 2, the copper substrate 1 is in the shape of a long strip, and slots 3 are evenly distributed along the length direction of the copper substrate 1, and the white light chip 2 is crystal-bonded in the slot 3.

[0019] Depend on figure 2 It can be seen that the cross-section of the slot 3 is a trapezoid with a wide top and a narrow bottom, and a left-right symmetrical trapezoid. The white light chip 2 is arranged on the bottom surface of the slot 3, and the inner wall of the slot 3 is coated with an optical reflective film 4. Encapsulated with optical colloid 5 .

Embodiment 2

[0021] Such as image 3 As shown, a high heat dissipation LED packaging structure includes a copper substrate 1 and a white light chip 2. The copper substrate 1 is circular, and a plurality of slots 3 are distributed on the copper substrate 1. The slots 3 are large at the top and small at the bottom. The bowl-shaped structure has an oval upper surface, and the white light chip 2 is crystal-bonded in the center of the bottom of the slot 3 .

[0022] Such as figure 1 or image 3 As shown, nine 1W LED chips 2 are packaged on a strip-shaped or circular copper substrate 1, and the entire substrate can form a 9W lighting fixture for indoor products such as lamp tubes or downlights.

[0023] Please refer to Figure 4 , assembled from 3 circular copper substrates 1 package into a 27W lighting fixture, which can be used for downlights, etc., and so on, LED lamps of different sizes can be assembled according to needs.

[0024] According to different sizes of the copper substrate 1 ,...

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Abstract

The invention discloses an LED (light emitting diode) packaging structure with high heat-dissipation capability. The LED packaging structure comprises a copper substrate and a white-light chip, wherein a groove is formed in the copper substrate; the white-light chip is crystallized in the groove; an optical reflecting film is plated on the inner wall of the groove; and optical colloid is packaged in the groove. The LED packaging structure with the high heat-dissipation capability is high in heat-dissipation effect; the heat of the LED chip is dissipated quickly, the junction temperature of the LED chip is low, the luminous decay can be reduced effectively, and the service life of the LED packaging structure is prolonged; and moreover, the outputting angle of LED light is large, and luminance uniformity is high.

Description

technical field [0001] The invention relates to a semiconductor light emitting device, in particular to a high heat dissipation LED packaging structure. Background technique [0002] With the continuous development of LED technology, LED packaging technology has become increasingly mature, but the existing LED packaging structure products generally have the problems of large light attenuation and short service life, especially for high-power LED packaging structure products. There are multiple LED chips, the LED chips are concentrated, and the heat cannot be dissipated immediately, which affects the stable operation of the LED, resulting in a large light decay of the LED chip and a severely shortened life. The greater the power, the more unstable the product. Contents of the invention [0003] In view of this, the present invention provides a highly heat-dissipating LED packaging structure, which enables the LED chip to dissipate heat faster, effectively reduces light deca...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/64
CPCH01L33/642
Inventor 王超种衍兵李黎明牟亚宇
Owner CHONGQING XINTIANYANG LIGHTING TECH
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