Mold for soldering copper mesh
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 日照大正焊接材料有限公司
- Publication Date
- 2016-04-20
Smart Images

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Abstract
Description
technical field
[0001] The invention relates to a mold structure, in particular to a mold for welding copper mesh. Background technique
[0002] like figure 1 Shown is a schematic structural view of a copper mesh, the copper mesh includes a circular or oval copper ring 61, a number of copper bars 62 welded in the inner ring, and the connected copper bars 62 keep the same distance as possible spacing. Both the copper ring 61 and the copper strip 62 are made of pure copper or copper alloy (such as copper-zinc alloy, copper-aluminum alloy or copper-selenium alloy), preferably lead-free brass (brass is a copper-zinc alloy) material.
[0003] However, due to the small thermal resistance of copper, rapid heat conduction, and the relatively low melting point of copper, when welding the copper strip 62 and the copper ring 61, the welding is difficult due to difficult positioning, and even the appearance quality of the welded product is poor. Contents of the invention
[0004] I...