ultra-thin reaction chamber

Abstract

The invention relates to the technical field of closed cavity devices used for laser gaseous phase chemical reaction and provides an ultrathin reaction cavity. The ultrathin reaction cavity comprises a substrate, wherein the substrate is provided with a reaction hole, a diaphragm, a nozzle part and a reaction gas distribution loop; the nozzle part is provided with a reaction gas nozzle; the reaction gas distribution loop is provided with an annular gas passage; the base is provided with a reaction gas inlet passage, a reaction gas outlet passage and a vacuum gas pumping passage; a reaction gas collection mouth and a vacuum gas pumping mouth are arranged on the lower surface of the substrate; grooves are formed in the reaction gas distribution loop; and the size of the grooves is gradually largened along the flow direction of gas. The reaction gas distribution loop is in a dismountable connection with the nozzle part, only one reaction gas inlet passage, one reaction gas outlet passage and one vacuum gas pumping passage are arranged on the substrate, the thickness of the ultrathin reaction cavity is thinner, reaction localization precision is higher, and remedy defects are small. Because the reaction gas is adjusted through the grooves, gas flow is balanced, spray of the reaction gas is uniform and stable, the reaction gas is intensive to deposition direction and airflow inlet and outlet, and the non-defective product repairing rate is improved.

Description

technical field [0001] The invention belongs to the technical field of airtight cavity devices used for laser gas-phase chemical reactions, and in particular relates to ultra-thin reaction chambers. Background technique [0002] At present, in the field of precision laser micromachining (micron, submicron, deep submicron level) such as semiconductor devices, liquid crystal, plasma, organic EL and other display devices and photomask manufacturing, semi-finished products often have some various Defects in form, these defects need to be repaired before they can become qualified products. Existing repairing technologies include: focused ion beam (FIB) repairing, dispensing (Dispensing) repairing, laser chemical vapor deposition (Laser Chemical VaporDeposition, LCVD) repairing, etc. Among them, the repair cost of laser vapor phase chemical deposition is moderate, and the repair effect also meets the requirements of use. [0003] In the existing laser vapor chemical deposition r...

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Problems solved by technology

[0005] The purpose of the present invention is to provide an ultra-thin reaction chamber, aiming at solving the problem of poor localization accuracy of laser gas-phase chemical reaction due to the large thickness of the existing reaction chamber and low efficiency of laser gas-phase chemical reaction due to uneven distribution of gas flow, and the effect of the repair area on the reaction. The gas flow deposition direction and the gas flow inlet and outlet areas are sensitive, poor deposition, and defect repair failures

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