Processing method of ptfe copper clad laminate
A processing method, PTFE technology, applied in the direction of electrical components, printed circuit manufacturing, printed circuit, etc., can solve the problem that burrs cannot be completely removed, and achieve the effect of avoiding burrs and improving processing efficiency
Inactive Publication Date: 2018-05-11
SHENZHEN SUNTAK MULTILAYER PCB
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Problems solved by technology
[0005] The purpose of the present invention is to provide a method for processing PTFE copper-clad laminates. By adjusting the direction of the milling cutter, it aims to solve the problem in the prior art that the burrs generated after processing plated through holes cannot be completely removed.
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[0027] In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.
[0028] Please refer to Figure 1 to Figure 4 , the processing method of the PTFE copper clad laminate provided by the embodiment of the present invention comprises the following steps:
[0029] S1 : Provide a PTFE copper clad laminate 1 . The PTFE copper clad laminate 1 includes a PTFE substrate 11 , a copper layer 12 located on the surface of the PTFE substrate 11 , and a copper layer 12 disposed between the copper layer 12 and the PTFE substrate 11 . Adhesive layer 13, the adhesive layer 13 is made of inert material; understandably, the PTFE copper clad laminate 1 is a double-sided copp...
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The invention is applied to the technical field of the machining of printed wiring boards, provides a machining method of a PTFE copper-clad plate, and aims to solve the problem in the prior art that burrs produced after plate milling cannot be thoroughly removed. The machining method comprises the following steps: providing a PTFE copper-clad plate, providing a milling cutter and a milling groove, performing milling groove machining on the PTFE copper-clad plate in a cutting way of adopting the milling cutter to cut a circle along a milling hole to be milled, forming a milling hole upward penetrating a copper layer, a bonding layer and a PTFE base material in the depth direction, ensuring that the milling cutter performs rotary motion to form a tangent plane with the direction being the same as the cutting direction, and ensuring that the tangent plane is coincident with the side wall of the milling hole. According to the machining method, as the tangent plane with the direction being the same as the cutting direction of the milling cutter on the PTFE copper-clad plate can be coincident with the side wall of the milling hole, the machining method can completely prevent burrs from being produced in the bonding layer during machining.
Description
technical field [0001] The invention belongs to the technical field of processing printed circuit boards, and in particular relates to a processing method of a PTFE copper-clad laminate. Background technique [0002] With the rapid development of the electronics and communication industries, the use of high-frequency materials and ultra-high-frequency materials has become more and more extensive. In view of the excellent characteristics of the material itself, the use of polytetrafluoroethylene (Poly Tetra Fluoro Ethylene, referred to as PTFE) copper clad laminate is also increasingly favored. Because PTFE has excellent dielectric properties (low dielectric constant and low dielectric loss) and good chemical stability and thermal stability, PTFE copper clad laminates are mainly used in satellite communications, mobile radio communications, satellite radio and television radar equipment and computers and other fields. [0003] Generally, a PTFE copper clad laminate usually ...
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IPC IPC(8): H05K3/00
CPCH05K3/0011H05K2203/0228
Inventor 林楠翟青霞白亚旭李金龙黄海蛟杜明星
Owner SHENZHEN SUNTAK MULTILAYER PCB