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Modular cooling system

A cooling system, modular technology, applied in the direction of cooling/ventilation/heating transformation, modification using liquid cooling, lighting and heating equipment, etc., can solve the problems of heavy, low specific heat, large system volume, etc., to achieve easy assembly, Cost-effective, cost-reliable results

Active Publication Date: 2015-04-29
HITACHI ENERGY SWITZERLAND AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, these systems are bulky and heavy as they typically require a deionization unit
Air cooling is another way to provide simple and cheap cooling of such power electronics, but it is limited by the poor thermophysical properties of air, which has low thermal conductivity and low specific heat

Method used

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  • Modular cooling system
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Examples

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Embodiment Construction

[0021] Reference will now be made in detail to various embodiments, one or more examples of which are illustrated in the figures. Each example is provided by way of explanation and not limitation. For example, features and / or method steps illustrated or described as part of one embodiment and / or method can be used on or in combination with other embodiments and / or method steps to yield still further embodiments or methods . It is intended that the present disclosure includes such modifications and variations.

[0022] Within the following description of the drawings, the same reference numerals designate the same or similar components. In general, only differences relating to individual embodiments are described. Unless otherwise specified, descriptions of parts or aspects in one embodiment are also applicable to corresponding parts or aspects in another embodiment.

[0023] Although specific features of various embodiments of the invention may be shown in some drawings an...

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PUM

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Abstract

According to the present disclosure, a modular cooling system 10 for cooling a plurality of electronic components 20 is provided. The cooling system comprises a plurality of cooling modules 30 and a clamping arrangement 40. Each cooling module 30 comprises an evaporator unit, a condenser, a first pipe system 70 and a second pipe system 80. The clamping arrangement 40 is adapted for holding and pressing an alternation stack 90 in which the evaporator units 50 are stacked in alternation with the power electronic components 20.

Description

technical field [0001] The subject matter described herein relates generally to cooling systems for power modules. In particular, the subject matter relates to evaporators, ie respectively two-phase coolers for electronic components, but also to cooling systems using such evaporators and methods of cooling electronic components such as for example power semiconductors. Background technique [0002] Power electronic components, such as semiconductor switching elements, are typically susceptible to thermal problems caused by the amount of thermal energy generated by the current flowing through them. As power electronic devices reach higher and higher power values ​​and thus dissipate thermal energy, the need for an efficient cooling system to maintain the reliability of such power electronic devices becomes more and more important. In addition, the trend towards higher power densities continues to challenge the design and efficiency of the cooling systems employed. Higher pow...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/427H01L23/473F28D15/02H05K7/20H01L23/467
CPCF28D15/0266H01L23/427H01L23/467H01L23/473H05K7/20336H05K7/20936F28D15/0241F28D15/0275F28F2270/00H01L2924/0002H01L2924/00H05K7/20309H05K7/20318
Inventor A. 布洛伯格B. 阿戈施蒂尼J. 倪J. 哈夫纳M. 哈伯特
Owner HITACHI ENERGY SWITZERLAND AG