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Multilayer ceramic capacitor and board with the same mounted thereon

A technology of multilayer ceramics and capacitors, which is applied in the direction of laminated capacitors, fixed capacitor dielectrics, fixed capacitor shells/packages, etc., and can solve problems such as limitations in bending strength, limitations in installation area and height, and high manufacturing costs.

Active Publication Date: 2015-05-06
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0011] However, the method of enlarging its edge in the length direction would be difficult to apply to high-capacitance multilayer ceramic electronic components, and the method of applying a polymeric material such as epoxy resin to the external electrodes would also have limitations in securing bending strength
[0012] In addition, in the method using a metal lead frame, there may be problems such as high manufacturing cost and limitations in mounting area and height

Method used

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  • Multilayer ceramic capacitor and board with the same mounted thereon
  • Multilayer ceramic capacitor and board with the same mounted thereon
  • Multilayer ceramic capacitor and board with the same mounted thereon

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Embodiment Construction

[0037] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0038] This disclosure may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0039] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0040] In order to clearly describe the exemplary embodiments of the present disclosure, directions of a hexahedron will be defined. L, W, and T shown in the drawings refer to a length direction, a width direction, and a thickness direction, respectively. Here, the thickness direction may be the same as the stacking direction al...

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Abstract

A multilayer ceramic capacitor may include a ceramic body including dielectric layers, first and second internal electrodes disposed in the ceramic body to face each other, the dielectric layer being interposed between the first and second internal electrodes, and first and second external electrodes covering both end surfaces of the ceramic body. The ceramic body may include an active layer as a capacitance forming part and a cover layer as a non-capacitive part disposed on at least one surface of upper and lower surfaces of the active layer, the cover layer including at least one buffer layer, and when a thickness of the cover layer is defined as tc, and a thickness of the buffer layer is defined as ti, ti / tc being in a range of 0.15 to 0.90 (0.15≰ti / tc≰0.90).

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2013-0130472 filed on October 30, 2013 in the Korean Intellectual Property Office, the disclosure of which is hereby incorporated by reference. technical field [0002] The present disclosure relates to a multilayer ceramic capacitor and a board on which the multilayer ceramic capacitor is mounted. Background technique [0003] In accordance with the recent trend toward miniaturization of electronic products, the demand for miniaturized and high-capacitance multilayer ceramic electronic components has increased. [0004] Therefore, dielectric layers and internal electrodes are thinned and stacked by various methods. Recently, multilayer ceramic electronic components have been manufactured in which the thickness of the dielectric layer is reduced and the number of stacked dielectric layers is increased. [0005] In addition, ceramic electronic components have recently been produced in which a diel...

Claims

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Application Information

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IPC IPC(8): H01G4/30H01G4/224H05K1/18
CPCH01G4/30H01G4/1227H01G4/224H01G4/12H01G2/065H01G2/06
Inventor 丁海硕金斗永金昶勋李淳哲尹锺现金基源
Owner SAMSUNG ELECTRO MECHANICS CO LTD
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