Optical detection implantable sensor and manufacturing method and control system thereof

A manufacturing method and sensor technology, applied in the field of medical devices, can solve the problems of complex manufacturing process and high cost, and achieve the effects of simple manufacturing process, small implant trauma, and simple control method

Active Publication Date: 2015-05-06
INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The light-emitting device and the photosensitive device of the existing photodetection implantable sensor are independent semiconductor devices, and the light-emitting device and the photosensitive device need to be formed on different substrates respectively, and the manufacturing process is complicated and the cost is high.

Method used

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  • Optical detection implantable sensor and manufacturing method and control system thereof
  • Optical detection implantable sensor and manufacturing method and control system thereof
  • Optical detection implantable sensor and manufacturing method and control system thereof

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Embodiment Construction

[0044] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0045] refer to figure 1 and figure 2 , figure 1 It is a structural schematic diagram of a light detection implantable sensor with a separate structure before packaging, figure 2 It is a schematic structural diagram of a packaged photodetection implantable sensor with a separate structure, and the photodetection implantable sensor with a separate structure includes: a light emitting device A1 and a photosensitive device A2. The light emittin...

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Abstract

The invention discloses an optical detection implantable sensor and a manufacturing method and a control method thereof. The sensor comprises a lighting device used for transmitting detection light of set strength to tissues of a human body, a light sensing device used for acquiring light intensity information of the detection light reflected by the tissues of the human body, wherein the lighting device and the light sensing device are formed on the front of the same substrate. The lighting device of the sensor and the light sensing device are manufactured by the same substrate, the sensor integration degree is improved, and the size is reduced. The sensor can be manufactured through the manufacturing method, the manufacturing process is simple, the control system adopts the sensor, the control method is simple, and the implantation wound is small.

Description

technical field [0001] The invention relates to the technical field of medical devices, and more specifically, to a light detection implantable sensor, a manufacturing method and a control system thereof. Background technique [0002] Using an implantable sensor composed of a light-emitting device and a photosensitive device, various characteristic parameters of human tissue can be measured and collected. Since the reflection and scattering of light by specific human tissues are fixed values, when the light-emitting device emits the set detection signal, various human tissue characteristic parameters of the human body can be measured and collected according to the intensity of the reflected signal obtained by the photosensitive device . [0003] The light emitting device and the photosensitive device of the existing light detection implantable sensor are independent semiconductor devices, and the light emitting device and the photosensitive device need to be formed on diffe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/173H01L31/18A61B5/00
CPCA61B5/00H01L31/173H01L31/18H01L31/1876Y02P70/50
Inventor 胡启方徐小宇陈岚任卓翔
Owner INST OF MICROELECTRONICS CHINESE ACAD OF SCI
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