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Packaging method of photoelectric sensing device and application

A technology of photoelectric induction and packaging method, which is applied in the direction of electrical components, semiconductor devices, optics, etc., can solve the problems affecting the thinness of the device, the limited display area of ​​the screen, and the increase of the vertical size of the system, so as to achieve low power consumption, reduce energy consumption, reduce The effect of small volume

Active Publication Date: 2015-05-06
上海芯晨科技有限公司
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  • Abstract
  • Description
  • Claims
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Problems solved by technology

Therefore, the viewing and operating screen display area is limited
Moreover, the packaged photoelectric sensor module also increases the longitudinal size of the entire system, which affects the thinness of the device.

Method used

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  • Packaging method of photoelectric sensing device and application
  • Packaging method of photoelectric sensing device and application
  • Packaging method of photoelectric sensing device and application

Examples

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Embodiment Construction

[0058] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0059] Please see attached picture. It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, and only the components related to the present invention are shown in the diagrams rather than the number, shape and shape of the components in actual implementation. Dimensional drawing, the type, quantity and proportion of each component can be changed arb...

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Abstract

The invention provides a packaging method of a photoelectric sensing device and application, and aims at integrating the photoelectric sensing device to a display panel. The photoelectric sensing device is a device integrating a plurality of functions; a carrier board equipped with the photoelectric sensing device is connected with the display panel by a circuit connecting manner; the photoelectric sensing device can receive an environmental light signal and directly output a feedback control signal by photoelectric sensing; the photoelectric sensing device can receive and respond to a distance signal as well as timely feeding back a digital signal to as to achieve the functions of saving electricity and avoiding mis-operation. With the adoption of such packaging structure, the size of elements in electronic products can be effectively reduced, thus the whole display device can be reduced, and meanwhile, the general packaging process of a mobile phone can be effectively simplified by the novel packaging process.

Description

technical field [0001] The invention relates to the field of photoelectric sensor and packaging technology, in particular to a packaging method and application of a photoelectric induction device. Background technique [0002] Electronic equipment such as mobile phones, personal computers, etc., in addition to providing a display panel as a display and operation platform, often also include photoelectric sensing devices for various functions. [0003] For example, a personal computer may use an ambient light sensor to measure the level of ambient light in the computer's work environment. When a large amount of ambient light is detected, it can be fed back to the control center to control the brightness of the screen to increase to help counteract the impact of ambient light. Some mobile phones contain proximity sensors that detect when the phone is brought close to the user's face. When the screen is close to the user's face, the touch function of the display panel of the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/18G02F1/1333
CPCG02F1/1333H01L31/1876Y02P70/50
Inventor 颜莉华
Owner 上海芯晨科技有限公司
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