Flip-chip LED substrate components and flip-chip LED packaging components

Abstract

The invention discloses a flip LED (light-emitting diode) substrate component and a flip LED packaging component. The flip LED substrate component and the flip LED packaging component include a substrate; conductive connectors are arranged on the substrate, and a chute is arranged on the substrate between the conductive connectors; connecting materials are coated along the conductive connectors, and connectors in the chute are removed along the chute through a cleaning piece. By adopting the scheme, the two conductive connectors can be effectively separated, breakover of two conductive connectors is prevented, and damage of the flip LED chip is avoided. Besides, for the process of coating the connecting materials is not required to accurately position, difficulty of the step is reduced, a high-precision positioning device is saved, and the working efficiency is improved while the cost is reduced. Through an ingenious design of arranging the chute on the substrate, the flip LED substrate component and the flip LED packaging component have huge economic benefit in the flip LED chip packaging field.

Description

technical field [0001] The invention relates to the technical field of flip-chip LED packaging, in particular to a flip-chip LED substrate and a flip-chip LED packaging component. Background technique [0002] LED (Light Emitting Diode), light-emitting diode, is a solid-state semiconductor device that can convert electrical energy into visible light. In order for LEDs to eventually be used in daily life, LEDs need to be packaged. For different LED chip structures, there are different ways, especially for flip-chip LED packaging, [0003] At present, the packaging of flip-chip LEDs includes packaging materials, wires, substrates and other structures, and also requires a variety of packaging processes, such as screen printing. In the process of flip-chip LED packaging, one of the methods is to coat solder or conductive glue on the copper sheet of the substrate by screen printing, and then electrically connect the electrodes of the flip-chip LED chip to the copper sheet. [...

AI Technical Summary

Problems solved by technology

[0004] However, in the process of coating solder or conductive glue, it may be coated between the two copper sheets due to positioning accuracy and other reasons, resulting in electrical conduction, short circuit during welding, and damage to the LED chip, or the process of fixing the conductive glue Finally, it is a technical problem in the field of packaging technology to damage the LED chip during use.

Images