Cell phone heat radiation structure and cell phone

A mobile phone heat dissipation structure and mobile phone technology, applied in the direction of telephone structure, cooling/ventilation/heating transformation, etc., can solve problems such as overheating, achieve sufficient heat dissipation, good user experience, and good heat dissipation effect

Active Publication Date: 2015-05-06
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] An object of the present invention is to propose a mobile phone heat dissipation structure, which solves the problem of overheating in the front area of ​​the two-in-one speaker and receiver and the main board area of ​​the existing mobile phone, so that the two-in-one front area of ​​the speaker and receiver And the motherboard area is fully dissipated

Method used

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  • Cell phone heat radiation structure and cell phone
  • Cell phone heat radiation structure and cell phone
  • Cell phone heat radiation structure and cell phone

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] as attached image 3 As shown, this embodiment provides a mobile phone heat dissipation structure, which can be applied to the existing ultra-thin mobile phone with a two-in-one structure of a speaker and a receiver, and the mobile phone includes a two-in-one front area 1 of a speaker and a receiver , the main board area 3 and the accessory area 4, the two sides of the two-in-one front area 1 of the speaker and the receiver are respectively provided with a camera area 5 and an antenna area 6, and the heat dissipation structure of the mobile phone includes at least one layer of heat dissipation material made of heat dissipation material. Layer 7 (as attached image 3 ), the heat dissipation layer 7 covers at least part of the speaker and receiver two-in-one front area 1 and at least part of the motherboard area 3 .

[0040] In this embodiment, as a preferred solution, the heat dissipation layer 7 covers the two-in-one speaker and receiver front area 1 , the main board a...

Embodiment 2

[0047] This embodiment provides a mobile phone, which includes the heat dissipation structure of the mobile phone as described in the first embodiment. The phone's two-in-one speaker and receiver front area and the motherboard area have a good heat dissipation effect, and the user experience is good.

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Abstract

The invention discloses a cell phone heat radiation structure and a cell phone and relates to the technical field of the cell phones. The cell phone comprises a loudspeaker and receiver two-in-one front surface region, a main board region and an accessory region, wherein a camera region and an antenna region are arranged on the two sides of the loudspeaker and receiver two-in-one front surface region; the cell phone heat radiation structure comprises at least one heat radiation layer made of a heat radiation material; the heat radiation layer covers at least one part of the loudspeaker and receiver two-in-one front surface region and at least one part of the main board region. The invention further discloses the cell phone comprising the cell phone heat radiation structure. The problems that the temperature of existing loudspeaker and receiver two-in-one front surface region and main board region is too high are solved so that the loudspeaker and receiver two-in-one front surface region and the main board region are sufficiently radiated.

Description

technical field [0001] The invention relates to the technical field of mobile phones, in particular to a mobile phone cooling structure and a mobile phone with the mobile phone cooling structure. Background technique [0002] In the design of smart phones, the speakers and receivers are usually designed separately, and the power of ordinary speakers is very low, about 200mW. The large amount of heat generated by the high temperature of the whole machine mainly comes from the motherboard area. The current solution to temperature rise and heat dissipation The method is basically to realize the heat dissipation of the motherboard area through the heat dissipation material, and for the speaker, due to the low power, it will not encounter the situation of unqualified temperature rise, and at the same time, due to the discrete design, it is not compatible with the heat generated by the motherboard. Areas are often far apart, and an environment with elevated temperatures is ideal. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H05K7/20
Inventor 李路路
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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