Cell phone heat radiation structure and cell phone

Abstract

The invention discloses a cell phone heat radiation structure and a cell phone and relates to the technical field of the cell phones. The cell phone comprises a loudspeaker and receiver two-in-one front surface region, a main board region and an accessory region, wherein a camera region and an antenna region are arranged on the two sides of the loudspeaker and receiver two-in-one front surface region; the cell phone heat radiation structure comprises at least one heat radiation layer made of a heat radiation material; the heat radiation layer covers at least one part of the loudspeaker and receiver two-in-one front surface region and at least one part of the main board region. The invention further discloses the cell phone comprising the cell phone heat radiation structure. The problems that the temperature of existing loudspeaker and receiver two-in-one front surface region and main board region is too high are solved so that the loudspeaker and receiver two-in-one front surface region and the main board region are sufficiently radiated.

Description

technical field [0001] The invention relates to the technical field of mobile phones, in particular to a mobile phone cooling structure and a mobile phone with the mobile phone cooling structure. Background technique [0002] In the design of smart phones, the speakers and receivers are usually designed separately, and the power of ordinary speakers is very low, about 200mW. The large amount of heat generated by the high temperature of the whole machine mainly comes from the motherboard area. The current solution to temperature rise and heat dissipation The method is basically to realize the heat dissipation of the motherboard area through the heat dissipation material, and for the speaker, due to the low power, it will not encounter the situation of unqualified temperature rise, and at the same time, due to the discrete design, it is not compatible with the heat generated by the motherboard. Areas are often far apart, and an environment with elevated temperatures is ideal. ...

AI Technical Summary

Problems solved by technology

[0016] An object of the present invention is to propose a mobile phone heat dissipation structure, which solves the problem of overheating in the front area of ​​the two-in-one speaker and receiver and the main board area of ​​the existing mobile phone, so that the two-in-one front area of ​​the speaker and receiver And the motherboard area is fully dissipated

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