Integrated silicon condenser microphone

A technology of silicon capacitor microphone and integrated circuit, which is applied in the field of microphone, can solve the problems of high MEMS packaging cost, etc., and achieve the effect of maintaining compatibility, ensuring consistency, and flexible layout and wiring methods

Inactive Publication Date: 2015-05-06
ACUTI MICROSYST
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

This makes the existing multi-MEMS sensitive component multiplexing technology face the high cost of separate MEMS packaging if it is compensated, but the way that the MEMS sensitive components are directly c

Method used

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  • Integrated silicon condenser microphone
  • Integrated silicon condenser microphone

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Embodiment Construction

[0034] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0035] figure 1 It is a schematic longitudinal sectional view of the structure of the microphone with the sound inlet covered on the casing according to an embodiment of the present invention; figure 2 It is a schematic longitudinal sectional view of the structure of the microphone with the sound inlet in the shell bottom plate of an embodiment of the present invention; as shown in the figure, the integrated silicon condenser microphone includes: a shell with...

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Abstract

The invention discloses an integrated silicon condenser microphone. The integrated silicon condenser microphone comprises a shell, which is provided with at least one sound inlet hole, a substrate, which is provided with a hole, two or four MEMS (Micro-Elecro-Mechanical System) sensing elements, which are in seamless physical connection, an integrated circuit and sound cavities, wherein the sound cavities are formed by the two or four MEMS sensing elements and the substrate together, specifically, the sound cavities of the two or four MEMS sensing elements are symmetrically communicated through holes in the substrate, and through the symmetrical sound cavities, which are shared and arranged in the shell and are formed by the same sound inlet path relative to the position of each MEMS sensing element, the sound wave is input until a sound transmission path for an electric signal, which is converted by the sound wave through each MEMS sensing element, is fully symmetrical for each MEMS sensing element in the silicon microphone, wherein a sound inlet path is a path formed from the sound inlet hole in the shell to the sound cavities to a vibrating diaphragm of each MEMS sensing element; the integrated circuit is used for buffering/amplifying and outputting the electric signal, which is converted by sending the sound wave to each MEMS sensing element through the sound transmission path.

Description

technical field [0001] The invention relates to the field of microphones, in particular to an integrated silicon capacitor microphone. Background technique [0002] Micro-Electro-Mechanical (MEMS, Micro-Electro-Mechanical System) microphones or silicon microphones are widely used for sound collection of tablet electronic devices due to their small size and suitable for surface mounting, such as mobile phones, MP3, recording pens and monitoring equipment, etc. In order to meet the growing material and cultural needs of the people, the volume, cost, signal-to-noise ratio and other indicators of silicon microphones are constantly being optimized and improved. In related optimization technical solutions, there are many attempts to improve the signal-to-noise ratio index under the existing processing technology conditions by using multiple silicon microphone MEMS sensitive elements together. [0003] The traditional silicon micro-microphone is a single MEMS sensitive element, w...

Claims

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Application Information

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IPC IPC(8): H04R19/04
Inventor 万蔡辛杨少军
Owner ACUTI MICROSYST
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