Manufacturing method of circuit board

Abstract

The invention relates to a manufacturing method of circuit board; the method comprises the following steps: lamination, applying an inner layer pattern transfer to a raw material substrate to form an inner layer circuit, and laminating to form a multi-layer circuit board; drilling, drilling holes on the multi-layer circuit board based on preset conditions; copper deposition and electroplating, depositing chemical copper and plating copper on the multi-layer circuit board; the method further comprises steps of: blocking holes with conduction resin, filling a conductive resin in the holes; resin grinding, grinding the conductive resin exposed out of the board surface; directly applying outer layer alkali etching pattern transfer to the resin-grinded multi-layer circuit board; transferring the circuit pattern on the outer layer of the multi-layer circuit board by pattern electroplating and alkali etching technology. The manufacturing method of circuit board has the following advantages: the technical limitation that alkali etching process cannot be applied in designing and making the outer layer of the board by POFV (Via Filling Plating) is broken through; copper deposition and electroplating are no longer needed after grinding the resin; the positive pattern transfer can be directly implemented; the machining process of the PCB board can be simplified; the production period is shortened; and the production efficiency is increased.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a method for manufacturing a circuit board. Background technique [0002] With the continuous development of communication products, PCB boards are more and more widely used in high-frequency and high-speed fields, and their designs have also begun to develop towards lightweight, with more and more dense wiring, and the insurmountable popularity of resin plug hole design, even There are a large number of products with special process requirements such as POFV (plated on filled via, electroplating and filling), steps, plate edge metallization, and ring-free holes / slots. [0003] However, electroplating and filling holes cannot be obtained by alkaline etching. The alkaline etching method is to electroplate first and then plug the hole. After the plug hole is solidified, the grinding process will destroy the surface tin. In the end, it cannot be etched by alkali, and the d...

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Problems solved by technology

[0003] However, electroplating and filling holes cannot be obtained by alkaline etching. The alkaline etching method is to electroplate first and then plug the hole. After the plug hole is solidified, the grinding process will destroy the surface tin. In the end, it cannot be etched by alkali, and the dry film will also be worn. ; However, steps, edge metallization, and ring-free holes cannot be obtained by acid etching (the dry film sealing ability cannot be guaranteed), so it is more difficult to deal with the coexistence of the two

If the method of alkaline etching is all used, the process will be long, and the surface copper and the hole copper will be plated together, and then the resin will plug the hole, and when the copper is deposited again and the pad of the hole in the plate is electroplated, the surface copper will be too thick to be fine-tuned. line

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