Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method

A manufacturing method and technology of stepped holes, which are applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit and other directions, can solve problems such as poor control of step depth and corrosion of conductive metal, and achieve control uniformity, ensure consistency, and solve problems. The effect of abnormal signal transmission

Active Publication Date: 2015-05-06
JIANGMEN SUNTAK CIRCUIT TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the process is simple, the depth of the steps is not easy to control in the process of gong steps. Moreover, the conductive metal will be attached to the stepped holes during electroplating, and the outer layer graphics in the subsequent process will corrode the conductive metal in the stepped holes.

Method used

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  • Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method
  • Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method
  • Manufacturing method of copper-cladded ladder hole of circuit board ladder surface and application of manufacturing method

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Embodiment

[0032] Such as figure 1 The circuit board with stepped holes covered with copper on the stepped surface includes a first core board 1, a second core board 2, a third core board 3, a first PP sheet 4, and a second PP sheet 5; the circuit board is provided with a ladder Hole 6. The wiring layer of this circuit board is false 6 layers, inner layer line width spacing: min 8 / 8miL, outer layer line width spacing: min 8 / 8miL, sheet material Tg: 150°C, outer layer copper layer thickness 1OZ. The thickness of the first core board 1 , the second core board 2 and the third core board 3 are all 2.0 mm; the fluidity of the first PP sheet and the second PP sheet is less than 0.06 mm.

[0033] A method for manufacturing a circuit board with stepped holes covered with copper on the stepped surface includes the following steps in sequence:

[0034] Drill out the first core board 1, the second core board 2, and the third core board 3 substrates; use the same drilling data to drill the periphe...

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Abstract

The invention discloses a manufacturing method of a copper-cladded ladder hole of a ladder surface and application of the manufacturing method and belongs to the field of production and manufacturing of a circuit board. The manufacturing method of the copper-cladded ladder hole of the circuit board ladder surface comprises the following steps: before manufacturing an outer-layer circuit, sealing the ladder hole in the circuit board; and after finishing the outer-layer circuit, opening a core plate and leaking the ladder hole. The phenomenon that an etching solution is filled into the ladder hole when the outer-layer circuit is produced by a post-procedure is avoided and the problem that copper of a ladder position is corroded by the etching solution is solved.

Description

technical field [0001] The invention belongs to the field of circuit board production and manufacturing, and in particular relates to a method for manufacturing a copper-clad stepped hole on a stepped surface of a circuit board and a circuit board to which it is applied. Background technique [0002] With the development of circuit board manufacturing technology, more and more circuit boards contain stepped holes. For circuit boards with stepped holes, the traditional manufacturing method is: first press the circuit board and the prepreg, then directly push out the steps, and then plate conductive metal in the stepped holes. Although the process is simple, the depth of the steps is not easy to control during the process of gong steps. Moreover, conductive metal will be attached to the stepped holes during electroplating, and the outer layer graphics in the subsequent process will corrode the conductive metal in the stepped holes. Contents of the invention [0003] In orde...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/42H05K3/46
CPCH05K3/429H05K2201/095
Inventor 韦昊刘晓畅邓峻汪广明
Owner JIANGMEN SUNTAK CIRCUIT TECH
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