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A heat sink and electronic equipment

A heat dissipation device and heat sink technology, which is applied in the direction of cooling/ventilation/heating transformation, etc., can solve the problems affecting the user experience effect and high shell temperature, and achieve the effect of reducing temperature, increasing heat dissipation channels, and improving user experience effect

Active Publication Date: 2017-12-01
LENOVO (BEIJING) LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The present application provides a heat dissipation device and electronic equipment, which solves the technical problem in the prior art that the temperature of the housing is too high due to excessive heat dissipated by the radiator, which affects the user experience effect, and achieves the reduction of the temperature of the housing. Technical effects that enhance user experience

Method used

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  • A heat sink and electronic equipment
  • A heat sink and electronic equipment
  • A heat sink and electronic equipment

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Experimental program
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Effect test

Embodiment 1

[0030] like figure 1 As shown, it is a schematic structural diagram of the heat dissipation device 100 according to the first preferred embodiment of the present application. The heat dissipation module 100 can be installed in any electronic device that needs heat dissipation, such as a mobile phone, a computer, a TV, a refrigerator, and the like.

[0031] The heat dissipation device 100 includes: a heating device 10 , a heat sink 20 , a conduction pad 30 and a heat conduction member 40 .

[0032] The heat generating device 10 generates heat. The heating device 10 can be a central processing unit (CPU), various co-processors (GPU, etc.), and other electronic components, and these devices generate heat when powered on. When the heat generated is too high, the temperature will be too high, which will affect the normal operation or service life of these devices.

[0033] The radiator 20 is used to dissipate the heat generated by the heating device 10 , and the radiator 20 may ...

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PUM

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Abstract

The invention discloses a cooling device and electronic equipment. The heat dissipation device includes: a heat generating device for generating heat; a heat sink for dissipating the heat; a conduction pad arranged between the heat generating device and the heat sink for conducting the heat; a heat conduction element including A first heat conduction sheet and an extended heat conduction sheet connected to the first heat conduction sheet, the first heat conduction sheet is arranged between the conduction pad and the heat generating device or between the conduction pad and the heat sink; Wherein, the thermal conductivity of the heat conduction member is greater than that of the conduction pad, and the first heat conduction sheet is used to transfer the heat dissipated by the heat sink or the heat conducted through the conduction pad to the extended heat conduction sheet, through the extension The heat spreader spreads out.

Description

technical field [0001] The present invention relates to the technical field of heat dissipation, and in particular, to a heat dissipation device and electronic equipment. Background technique [0002] With the development of science and technology and the progress of society, electronic devices such as computers, mobile phones, and televisions have become an indispensable part of people's life and work. [0003] In order to ensure that the electronic devices in the electronic device can work normally, the electronic device is usually provided with a heat sink. The heat dissipation device includes: a heat generating device (such as a central processing unit, an electronic component, etc.) that emits heat during operation, a heat sink that emits the heat, and a conductive pad disposed between the heat generating device and the heat sink. The conductive pad is used for transferring the heat emitted by the heating device to the heat sink for dissipation. Usually, the heat sink...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K7/20
Inventor 李金玉杨大业
Owner LENOVO (BEIJING) LTD