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Laser airtight welding process-based packaged structure of high-frequency microwave product and manufacturing method for package structure

A high-frequency microwave and welding process technology, applied in the field of packaging structure design of high-frequency microwave products, to achieve the effects of anti-corrosion packaging, providing mechanical strength and ensuring reliability

Active Publication Date: 2015-05-27
BEIJING RES INST OF TELEMETRY +1
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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a packaging structure and method for high-frequency microwave products based on laser airtight welding technology in view of the current situation that most high-frequency microwave products have high requirements on the environment during use, so as to Meet the airtightness requirements of the product and improve the matching accuracy between the product shell and the cover plate

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  • Laser airtight welding process-based packaged structure of high-frequency microwave product and manufacturing method for package structure
  • Laser airtight welding process-based packaged structure of high-frequency microwave product and manufacturing method for package structure

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Embodiment Construction

[0019] The packaging structure and method of high-frequency microwave products based on the laser hermetic welding process according to the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0020] The packaging structure and the manufacturing method thereof of the present invention are mainly based on the adoption of laser airtight welding technology. The laser sealing welding process can well solve the defects and deficiencies of the conventional welding process for high-frequency microwave products, such as: unreliable air tightness, excessive welding residue, and limited welding materials. Due to the particularity of laser hermetic welding, there are special requirements for the structural design of the product. Aiming at this requirement, the present invention designs the encapsulation structure.

[0021] Such as figure 1 As shown, the high-frequency microwave product packaging structure ba...

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Abstract

The invention provides a laser airtight welding process-based packaged structure of a high-frequency microwave product and a manufacturing method for the packaged structure. The packaged structure comprises a box, an upper cover plate and a lower cover plate; a first groove and a second groove are formed in the open end of the box, and are respectively matched with the two cover plates; by fixing the lower cover plate in the first groove with screws, and fixing the upper cover plate in the second groove in an interference fit and laser welding manner, the moisture-proof and anti-corrosion packaging of the to-be-packaged high-frequency microwave product is realized, the mechanical strength of a to-be-packaged electronic component is improved, and the reliability of the electronic component is guaranteed.

Description

technical field [0001] The invention belongs to the field of package structure design of high-frequency microwave products, and in particular relates to a package structure of high-frequency microwave products based on a laser airtight welding process and a manufacturing method thereof. Background technique [0002] At present, most electronic products, especially high-frequency microwave products containing bare chips, have higher requirements on the environment during use. In order to prevent product failure due to moisture, ions in the atmosphere, corrosive atmosphere, etc., most of these component products require hermetic packaging. The sealed casing of the product should have the functions of isolating the invasion of harmful gases from the outside, improving the mechanical strength of the electronic components, and ensuring the reliability of the electronic components. How to improve the matching precision between the packaging structure casing and the cover plate bec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23P15/00B23K26/21B23K33/00
CPCB23K26/20B23K33/00B23P15/00
Inventor 王丽菊高倩于秀媛宋涛
Owner BEIJING RES INST OF TELEMETRY
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