Dendritic high-temperature-resistant polyurethane resin prepolymer and preparation method thereof

A technology of polyurethane resin and dendrite, which is applied in the field of dendritic high-temperature resistant polyurethane resin prepolymer and its preparation, and achieves a wide range of applications

Inactive Publication Date: 2015-05-27
烟台万华合成革集团华海聚氨酯有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the formula of the present invention, the polyether with higher rigid group content is selected as one of the raw materials for polyurethane foam molding, and the rigid group with high stability is directly embedded in the molecular main chain of the material, and micron SiO2 is added as a temperature-resistant auxiliary agent at the same time. To achieve the purpose of maintaining good mechanical properties of materials in high temperature environments, although the structure has changed and high temperature additives have been added at the same time, the problem has not been fundamentally solved

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0061] Example 1: Dissolve 50 grams of 4,4′-diphenylmethane diisocyanate in 40 grams of toluene, control the temperature not higher than 20°C (the lower the temperature, the better), add dropwise 36 grams of G1.0 A mixture of amino-dendritic polyamidoamine and toluene, wherein the weight ratio of G1.0-generation amino-terminated dendritic polyamidoamine to toluene is 1:1, that is, the G1.0-generation amino-terminated dendritic polyamidoamine is 18 grams, and toluene Be 18 grams;, the weight ratio is 1:1, and dropwise control temperature is 1 hour at 20 ℃ of reaction times, adjusts solid content with toluene and is 50%, makes NCO content and is the dendritic polyurethane resin prepolymerization of 6.1%. body.

Embodiment 2

[0062] Example 2: Dissolve 50 grams of 4,4′-diphenylmethane diisocyanate in 40 grams of dimethylformamide, control the temperature not higher than 20°C (the lower the temperature, the better), add 72 grams of G1. A mixture of 0-generation hydroxyl-terminated dendritic polyamidoamine and dimethylformamide, wherein the weight ratio of G1.0-generation hydroxyl-terminated dendritic polyamidoamine to dimethylformamide is 1:1, and the weight ratio is 1 : 1, control temperature at 20 ℃ of reaction time 5 hours after dropping, adjust solid content to be 50% with dimethylformamide, make NCO content and be the dendritic polyurethane resin prepolymer of 4.7%.

Embodiment 3

[0063] Example 3: Dissolve 50 grams of 4,4′-diphenylmethane diisocyanate in 40 grams of dimethylformamide, control the temperature not higher than 20°C (the lower the temperature, the better), add 87 grams of G3. A mixture of 0-generation hydroxyl-terminated dendritic polyamidoamine and ethyl acetate, the weight ratio of G3.0-generation hydroxyl-terminated dendritic polyamidoamine to ethyl acetate is 1:1, and the temperature is controlled at 60°C after the addition is completed. Reaction time In 2 hours, it was 50% to adjust the solid content with ethyl acetate to make a dendritic polyurethane resin prepolymer with an NCO content of 4.4%.

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PUM

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Abstract

The invention discloses a dendritic high-temperature-resistant polyurethane resin prepolymer and a preparation method thereof. The preparation method is characterized by comprising the following steps: dissolving isocyanate in a first solvent, dropping a mixture of a dendritic molecular polymer and a second solvent at a weight ratio of 1:1, reacting at 20-60 DEG C for 1-5 h after dropping, and adjusting the solid content to be 50% by using a third solvent so as to prepare the dendritic polyurethane resin prepolymer, the NCO content of which is 1-7.5%. Because the dendritic high-temperature-resistant polyurethane resin prepolymer prepared by the invention has a dendritic three-dimensional spherical structure, the temperature tolerance of a prepared polyurethane product is greatly increased; and the dendritic high-temperature-resistant polyurethane resin prepolymer can be widely applied in the field of packaging of high-temperature-resistant synthetic leathers, coatings and electronics, and has important significance for promoting technological innovation of novel polyurethane materials.

Description

Technical field: [0001] The invention relates to a dendritic high temperature resistant polyurethane resin prepolymer and a preparation method thereof. The invention belongs to the technical field of dendritic molecular materials. Background technique: [0002] Polyurethanes are made by reacting polyols with isocyanates. Due to the characteristics of expandability, elasticity, abrasion resistance, adhesion, low temperature resistance, solvent resistance and biological aging resistance, it is widely used. It is a new polymer material that develops very fast. However, due to the linear structure of polyurethane, the temperature resistance of polyurethane is generally not high, and ordinary polyurethane cannot be used at high temperatures, such as high-temperature coatings, electronic and electrical packaging, high-temperature decorative embossing of polyurethane synthetic leather, high-temperature-resistant polyurethane insulation, etc. Therefore, It must be modifi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G18/64C08G18/10
CPCC08G18/6415C08G18/10C08G18/6469
Inventor 何相安纪宏伟
Owner 烟台万华合成革集团华海聚氨酯有限公司
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