Plastic-encapsulated type intelligent power module conveying system

Abstract

The invention discloses a plastic-encapsulated type intelligent power module conveying system, which comprises a guide rail device, a conveying device and a driving device, wherein the guide rail device comprises a bottom plate, and baffles arranged on the two sides of the bottom plate and extending in the longitudinal direction; a convex part positioned between the baffles is arranged on the bottom plate; the bottom plate, the baffles on the two sides and the convex part form a conveying space of plastic-encapsulated type intelligent power modules; the conveying device is arranged on the guide rail device; the driving device drives the conveying device to run. The traditional material box is replaced with the plastic-encapsulated type intelligent power module conveying system disclosed by the invention, so that the product quality problem caused by material box pollution is avoided, the automation degree of the whole production line is improved, the production efficiency of the plastic-encapsulated type intelligent power modules is improved and the production cost is reduced.

Description

technical field [0001] The invention relates to the processing field of plastic-encapsulated intelligent power modules, in particular to a transmission system for plastic-encapsulated intelligent power modules. Background technique [0002] Plastic-encapsulated IPM (Intelligent Power Module, Intelligent Power Module) is a new type of control module that integrates the IGBT chip and its drive circuit, control circuit and overcurrent, undervoltage, short circuit, overheating and other protection circuits. It is a complex and advanced power module that can automatically realize complex protection functions such as overcurrent, undervoltage, short circuit and overheating, so it has intelligent features. At the same time, it has the advantages of low cost, miniaturization, high reliability, and easy use. It is widely used in frequency conversion home appliances, inverter power supplies, industrial control and other fields, and its social and economic benefits are considerable. ...

AI Technical Summary

Problems solved by technology

However, in the existing process, there are many inconveniences in using the material box

For example, in the process of loading the plastic-encapsulated IPM into the material box, it is very likely that the pins of the plastic-encapsulated IPM will be bent due to material jams and other reasons, which will affect the yield of the product and also affect the later test workbench

In addition, the semiconductor production process is completed in the ultra-clean workshop, and the cleaning of the material box is also a task that must be carried out every day. Because in mass production, the amount of material box is quite large, so for a large number of material boxes Cleaning takes a lot of time and money

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