Substrate heating device and substrate heating method

A heating device and heating method technology, which is applied in the direction of electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of uneven density of heating plate, poor uniformity of film thickness distribution, uneven heating of substrate, etc.

Active Publication Date: 2015-06-03
BOE TECH GRP CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Existing heating techniques such as figure 1 As shown, the temperature of the substrate is directly provided by the heating plate. Due to the uneven density of the heating plate itself or the presence of impurities, the uneven heating of the substrate will lead to uneven temperature distribution of the subst

Method used

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  • Substrate heating device and substrate heating method
  • Substrate heating device and substrate heating method
  • Substrate heating device and substrate heating method

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[0060] In order to be able to understand the above-mentioned objectives, features and advantages of the present invention more clearly, the present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the embodiments of the application and the features in the embodiments can be combined with each other if there is no conflict.

[0061] In the following description, many specific details are set forth in order to fully understand the present invention. However, the present invention can also be implemented in other ways different from those described here. Therefore, the protection scope of the present invention is not limited to the specific details disclosed below. Limitations of the embodiment.

[0062] Such as image 3 As shown, a substrate heating device according to an embodiment of the present invention includes:

[0063] Heating layer 1, used to conduct heat;

[0064] The transfer tu...

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Abstract

The invention relates to a substrate heating device and a substrate heating method. The device comprises a heating layer used for conducting heat, a transmission tube used for transmitting gas to a diffusion layer, the diffusion layer arranged on the heating layer and used for enabling the gas to be uniformly distributed between a lead-out layer and the heating layer, and the lead-out layer arranged on the diffusion layer and internally and uniformly provided with a plurality of through holes, wherein the through holes are used for leading out the gas in the diffusion layer to a lower side of a to-be-heated substrate, thereby enabling the to-be-heated substrate to be uniformly heated. Through the technical scheme of the invention, the to-be-heated substrate can be uniformly and comprehensively heated, so that the temperature of an upper surface of the to-be-heated substrate is more uniform and processes such as etching, depositing and/or sputtering performed on the to-be-heated substrate are enabled to achieve better effects.

Description

technical field [0001] The present invention relates to the field of display technology, in particular, to a substrate heating device and a substrate heating method. Background technique [0002] The current preparation of low-temperature polysilicon thin film transistor array substrates is developing towards high resolution and high performance. Existing heating techniques such as figure 1 As shown, the temperature of the substrate is directly provided by the heating plate. Due to the uneven density of the heating plate itself or the presence of impurities, the uneven heating of the substrate will lead to uneven temperature distribution of the substrate, which will lead to poor uniformity of film thickness distribution on the substrate. , the thickness distribution is as figure 2 As shown, the uniformity of the film thickness on the surface can only reach 4.5%, which will affect the uniformity of the film deposition, sputtering and etching processes of the substrate. C...

Claims

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Application Information

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IPC IPC(8): H01L21/00H01L21/02
CPCH01L21/67011H01L21/77H01L21/67103H01L21/67109H01L21/68742H01L21/00H01L21/324H01L21/67248H01L22/26
Inventor 陆小勇许晓伟左岳平田宏伟张宇龙春平
Owner BOE TECH GRP CO LTD
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