Substrate heating device and substrate heating method

Abstract

The present invention relates to a substrate heating device and a substrate heating method. The device comprises: a heating layer for conducting heat; a transmission tube for transmitting gas to the diffusion layer; a diffusion layer arranged on the heating layer for The gas is evenly distributed between the lead-out layer and the heating layer; the lead-out layer is arranged on the diffusion layer, and a plurality of through holes are uniformly arranged in it, and the plurality of through holes are used to lead the gas in the diffusion layer to the substrate to be heated below, so that the substrate to be heated is evenly heated. Through the technical scheme of the present invention, the substrate to be heated can be heated evenly and comprehensively, so that the temperature of the upper surface of the substrate to be heated is more uniform, so that the etching, deposition and / or sputtering processes of the substrate to be heated can obtain better effects .

Description

technical field [0001] The present invention relates to the field of display technology, in particular, to a substrate heating device and a substrate heating method. Background technique [0002] The current preparation of low-temperature polysilicon thin film transistor array substrates is developing towards high resolution and high performance. Existing heating techniques such as figure 1 As shown, the temperature of the substrate is directly provided by the heating plate. Due to the uneven density of the heating plate itself or the presence of impurities, the uneven heating of the substrate will lead to uneven temperature distribution of the substrate, which will lead to poor uniformity of film thickness distribution on the substrate. , the thickness distribution is as figure 2 As shown, the uniformity of the film thickness on the surface can only reach 4.5%, which will affect the uniformity of the film deposition, sputtering and etching processes of the substrate. C...

AI Technical Summary

Problems solved by technology

Existing heating techniques such as figure 1 As shown, the temperature of the substrate is directly provided by the heating plate. Due to the uneven density of the heating plate itself or the presence of impurities, the uneven heating of the substrate will lead to uneven temperature distribution of the substrate, which will lead to poor uniformity of film thickness distribution on the substrate. , the thickness distribution is as figure 2 As shown, the uniformity of film thickness on the surface can only reach 4.5%, which will affect the uniformity of substrate film deposition, sputtering and etching processes

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