Processing method of female and male thick copper circuit board

A circuit board, yin and yang technology, applied in printed circuit, chemical/electrolytic method to remove conductive material, printed circuit manufacturing, etc., to achieve strong anti-corrosion ability and good bonding force

Active Publication Date: 2015-06-03
SHENNAN CIRCUITS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] An embodiment of the present invention provides a method for processing a yin-yang thick copper circuit boar

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  • Processing method of female and male thick copper circuit board
  • Processing method of female and male thick copper circuit board
  • Processing method of female and male thick copper circuit board

Examples

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Example Embodiment

[0018] Embodiments of the present invention provide a method for processing a yin-yang thick copper circuit board, so as to solve the above-mentioned problems existing in the existing two-sided etching process. In order to make those skilled in the art better understand the solutions of the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only Embodiments are part of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Please refer to figure 1 , an embodiment of the present invention provides a method for processing a yin-yang thick copper circuit board...

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Abstract

The invention discloses a processing method of a female and male thick copper circuit board. The processing method comprises the following steps that a thick copper foil, a thin copper foil and an inner layer plate are provided; the thick copper foil is subjected to single-side etching, so that a non-circuit-pattern region of the thick copper foil is etched to reduce the thickness; the thick copper foil and the thin copper foil are pressed on the two sides of the inner layer plate, so that the etched side of the thick copper foil faces the inner layer plate, and the female and male thick copper circuit board is obtained; the female and male thick copper circuit board is subjected to double-side etching, so that the non-circuit-pattern regions of the thick copper foil and the thin copper foil are removed through being etched, and circuit patterns are formed. Through the technical scheme, the processing method solves the problems that in the existing single-side etching process, a dry film covers the circuit patterns, the bonding force is low, and the anti-corrosion capability is poor. The processing method also solves the problems that in the existing circuit compensation process, the compensation design needs to be added to one side of the thin copper coil, so that the problems that the circuit space is large, and fine and tight circuits cannot be processed are caused.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for processing a yin-yang thick copper circuit board. Background technique [0002] For the male and female thick copper circuit boards with different copper foil thicknesses on both sides, the prior art usually adopts single-side etching process or line compensation process. [0003] Among them, the single-side etching process includes: first etching the circuit pattern on the first side, in this process, completely covering and protecting the second side with a dry film; Surface etched circuit graphics. [0004] The single-side etching process has the following defects: the first side needs to be covered with a dry film for protection during the second etching, but since the first side has been etched with circuit patterns and the surface is uneven, the covered dry film is easy to partially wrinkle, resulting in poor adhesion. Poor, low corrosion resistance. ...

Claims

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Application Information

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IPC IPC(8): H05K3/06H05K3/00
CPCH05K3/06H05K2203/1476H05K2203/1484
Inventor 黄立球刘宝林
Owner SHENNAN CIRCUITS
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