Processing method of female and male thick copper circuit board

Abstract

The invention discloses a processing method of a female and male thick copper circuit board. The processing method comprises the following steps that a thick copper foil, a thin copper foil and an inner layer plate are provided; the thick copper foil is subjected to single-side etching, so that a non-circuit-pattern region of the thick copper foil is etched to reduce the thickness; the thick copper foil and the thin copper foil are pressed on the two sides of the inner layer plate, so that the etched side of the thick copper foil faces the inner layer plate, and the female and male thick copper circuit board is obtained; the female and male thick copper circuit board is subjected to double-side etching, so that the non-circuit-pattern regions of the thick copper foil and the thin copper foil are removed through being etched, and circuit patterns are formed. Through the technical scheme, the processing method solves the problems that in the existing single-side etching process, a dry film covers the circuit patterns, the bonding force is low, and the anti-corrosion capability is poor. The processing method also solves the problems that in the existing circuit compensation process, the compensation design needs to be added to one side of the thin copper coil, so that the problems that the circuit space is large, and fine and tight circuits cannot be processed are caused.

Description

technical field [0001] The invention relates to the technical field of circuit boards, in particular to a method for processing a yin-yang thick copper circuit board. Background technique [0002] For the male and female thick copper circuit boards with different copper foil thicknesses on both sides, the prior art usually adopts single-side etching process or line compensation process. [0003] Among them, the single-side etching process includes: first etching the circuit pattern on the first side, in this process, completely covering and protecting the second side with a dry film; Surface etched circuit graphics. [0004] The single-side etching process has the following defects: the first side needs to be covered with a dry film for protection during the second etching, but since the first side has been etched with circuit patterns and the surface is uneven, the covered dry film is easy to partially wrinkle, resulting in poor adhesion. Poor, low corrosion resistance. ...

AI Technical Summary

Problems solved by technology

[0007] An embodiment of the present invention provides a method for processing a yin-yang thick copper circuit board to solve the above-mentioned problems existing in the existing single-side etching and line compensation processes

Images