Dicing sheet with protective film forming layer and chip fabrication method

A manufacturing method and technology of protective film, which can be applied in the fields of film/sheet release liner, film/sheet adhesive, semiconductor/solid-state device manufacturing, etc., which can solve the problem of increased number of processes, increased product cost, and decreased yield and other problems to achieve the effect of preventing damage, inhibiting deformation or peeling

Active Publication Date: 2015-06-03
LINTEC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method increases the number of steps, leading to an increase in product cost
In addition, since the thickness accuracy of the protective film formed as described above is not sufficient, the yield of the product may decrease.

Method used

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  • Dicing sheet with protective film forming layer and chip fabrication method
  • Dicing sheet with protective film forming layer and chip fabrication method
  • Dicing sheet with protective film forming layer and chip fabrication method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～4 and comparative example 1～3

[0172] Using the compositions for protective film-forming layers containing the above-mentioned components in the compounding ratios shown in Table 1, slices with protective film-forming layers were produced, and various physical properties were evaluated. The results are shown in Table 2.

[0173] [Table 1]

[0174]

[0175] [Table 2]

[0176]

Example 1

Example 2

Example 3

Example 4

Comparative example 1

Comparative example 2

Comparative example 3

Tg(°C) of acrylic polymer

4

4

17

-28

4

4

4

Storage modulus (GPa)

0.7

2.5

0.6

0.7

0.5

0.4

3

punching workability

A

A

B

A

A

A

C

Distortion on Pickup

A

A

A

A

B

B

A

[0177] From the results in Table 2, when the storage modulus of the protective film forming layer is 0.6 to 2.5 GPa, both punchability and deformability are good. Slices with a storage...

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PUM

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Abstract

[Problem] To provide a dicing sheet with a protective film forming layer, provided with a precut and hardened protective film forming layer, wherein when the dicing sheet is fabricated, the protective film forming layer is not deformed even when subjected to die punch processing using a die cutter. [Solution] This dicing sheet with a protective film forming layer (10) is characterized in that a hardened protective film forming layer (4) is temporarily affixed, so as to be peelable, to the inner circumference of a support body (3) having an adhesive section on the outer circumference thereof, and the storage elasticity coefficient of the protective film forming layer at 23°C prior to hardening is 0.6-2.5 GPa.

Description

technical field [0001] The present invention relates to a slice with a protective film forming layer that is formed on the back of a chip and can also be used as a slice, and particularly relates to a slice with a protective film forming layer that is not damaged or deformed at the end of the protective film forming layer . Moreover, this invention relates to the manufacturing method of the chip|tip using the dicing with a protective film forming layer. Background technique [0002] In recent years, semiconductor devices have been manufactured using a mounting method called a so-called face down method. In the flip-chip method, a semiconductor chip (hereinafter also simply referred to as a "chip") having electrodes such as bumps on a circuit surface is used, and the electrodes are bonded to a substrate. Therefore, the surface (chip back surface) opposite to the circuit surface of the chip may be exposed. [0003] The exposed chip back surface may be protected with an orga...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/301C09J7/02C09J133/00C09J7/40
CPCC09J7/40C09J133/02H01L21/6836H01L2221/68336H01L2221/68327C09J2433/005C09J2203/326
Inventor 高山佳篠田智则佐伯尚哉高野健
Owner LINTEC CORP
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