Method for measuring automatic-adjustment casual inspection frequency according to integrated circuit process capability indexes

Abstract

The invention discloses a method for measuring automatic-adjustment casual inspection frequency according to integrated circuit process capability indexes. The method is characterized in that a process capability index calculation module is embedded behind each different-process module of a production execution system and connected with a server for controlling product measurement, process measurement data are acquired by the calculation module according to the set time period to calculate the process capability indexes, obtained operation results are transmitted to the server, and the casual inspection frequency of subsequent products is automatically adjusted by the server according to the defined casual inspection frequency of the products corresponding to different process capability indexes and fed back to the production execution system; when the process capability indexes decline, the casual inspection frequency of measurement can be automatically increased; when the process capability indexes return to reasonable standards, the casual inspection frequency of measurement can be automatically lowered, so that measurement resources are efficiently distributed to the most needed process, the cost can be considered in the maximum limit and production risks can be effectively controlled.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit detection, and more specifically, to a measurement method that can automatically adjust the sampling frequency according to the level of the integrated circuit process capability index. Background technique [0002] The manufacture of integrated circuits is a very complex process, mainly including several major process modules such as photolithography, etching, film growth, ion implantation and cleaning. In actual production, in order to detect abnormal problems in the production process in time, a variety of measuring equipment is often equipped to measure such as graphic size, thickness, alignment, etc. [0003] see figure 1 , figure 1 It is a schematic flow chart of the production and operation of the existing integrated circuit process. Its operation process is as follows figure 1 As shown, corresponding measuring devices 4 , 5 and 7 are provided between process fl...

AI Technical Summary

Problems solved by technology

[0007] However, because the current process measurement system cannot identify the process capability, the process with better process (higher Cpk) may measure too much product, wasting a lot of measurement resources; while the process with poorer process (Cpk Low) the measurement of the product is too small, which increases the risk of production

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