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Composite structures using interpenetrating polymer network adhesives

A technology of polymers and compositions, applied in non-polymer organic compound adhesives, adhesives, adhesive additives, etc., can solve problems such as unsuitable residual stress

Inactive Publication Date: 2015-06-17
THE BOEING CO
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, IPN is not suitable for addressing the problem of residual stresses in composites caused by the differential expansion of the components forming the composite

Method used

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  • Composite structures using interpenetrating polymer network adhesives
  • Composite structures using interpenetrating polymer network adhesives
  • Composite structures using interpenetrating polymer network adhesives

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Experimental program
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Embodiment approach

[0124] Clause 1. A composition consisting essentially of:

[0125] a first polymer system having a first modulus of about 180 ksi to about 335 ksi consisting essentially of thermosetting acrylates; and

[0126] A second polymer system consisting essentially of:

[0127] a thermosetting epoxy resin system comprising a first epoxy resin; and

[0128] Epoxy resin curing agent.

[0129] Clause 2. The composition of Clause 1, wherein the thermosetting acrylate is bisphenol A diacrylate.

[0130] Clause 3. The composition of clause 1 or 2, wherein the second polymer system has a second modulus, wherein the second modulus has a value of about 60% or less of the first modulus.

[0131] Clause 4. The composition of clauses 1-3, wherein the first epoxy resin is diglycidyl ether of bisphenol A, and wherein the thermosetting epoxy resin system further comprises polypropylene glycol diglycidyl ether.

[0132] Clause 5. The composition of Clause 4, wherein the thermosetting epoxy resin ...

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Abstract

A composition is provided that consists essentially of a first polymer system and a second polymer system. The first polymer system has a first modulus of about 180 ksi to about 335 ksi. The first polymer system consists essentially of a thermosetting acrylate. The second polymer system consists essentially of a thermosetting epoxy system and an epoxy curing agent. The thermosetting epoxy system comprises a first epoxy.

Description

technical field [0001] The present disclosure relates generally to composite structures, and more particularly to adhesives used in such composite materials. Background technique [0002] Composite structures that include components with different coefficients of thermal expansion can induce residual stresses in the structure during thermal curing or other manufacturing processes that cause the components to thermally expand at different rates. For example, and without limitation, hybrid composite structures including carbon fiber polymer reinforced metal may undergo thermally induced distortion when cured at elevated temperatures. In some cases, this problem can be solved by using fiber-reinforced polymers that cure at room temperature or by using various forms of radiation curable. However, room temperature cure polymers can have short pot lives, long cure times, and require additional cleanup. Room temperature curing polymers may also exhibit reduced performance charact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J4/02C09J11/06
CPCC08L63/10B29C66/721B29C66/742B29C65/4845B29C65/4835B29C66/034B29C66/73756B29C66/1122B29C65/1406B29C65/1403B29L2031/3076B29C66/7212B29C66/73941B29C66/71C08F222/103C08F222/1025C08L63/00B29K2307/04B29K2309/08B29K2277/10B29K2063/00B29K2033/08
Inventor G·R·韦伯
Owner THE BOEING CO