Composite structures using interpenetrating polymer network adhesives
A technology of polymers and compositions, applied in non-polymer organic compound adhesives, adhesives, adhesive additives, etc., can solve problems such as unsuitable residual stress
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[0124] Clause 1. A composition consisting essentially of:
[0125] a first polymer system having a first modulus of about 180 ksi to about 335 ksi consisting essentially of thermosetting acrylates; and
[0126] A second polymer system consisting essentially of:
[0127] a thermosetting epoxy resin system comprising a first epoxy resin; and
[0128] Epoxy resin curing agent.
[0129] Clause 2. The composition of Clause 1, wherein the thermosetting acrylate is bisphenol A diacrylate.
[0130] Clause 3. The composition of clause 1 or 2, wherein the second polymer system has a second modulus, wherein the second modulus has a value of about 60% or less of the first modulus.
[0131] Clause 4. The composition of clauses 1-3, wherein the first epoxy resin is diglycidyl ether of bisphenol A, and wherein the thermosetting epoxy resin system further comprises polypropylene glycol diglycidyl ether.
[0132] Clause 5. The composition of Clause 4, wherein the thermosetting epoxy resin ...
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