Different-space different-size substrate alignment method

A space and size technology, applied in the field of substrate alignment, which can solve the problems that different-sized alignment objects cannot be image aligned, and cannot use overlapping alignment mark designs.

Active Publication Date: 2015-06-24
METAL INDS RES & DEV CENT
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  • Abstract
  • Description
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Problems solved by technology

[0005] The previous technology is to synthesize the overlapping mark image with the alignment mark to calculate the alignment in a single coordinate space, and it can only be carried out on the substrate of the same size.
[0006] However, in the process of some high-tech industries, often due to the particularity of materials, when using image visual aids for lamination, combination or combination, it is often encountered that alignment objects of different sizes cannot be carried out in the same image capture unit. Trouble with image alignment
For example, in the touch panel industry, because touch panels have various and different-sized multi-layer lamination processes, it is sometimes impossible to use overlapping alignment mark designs

Method used

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  • Different-space different-size substrate alignment method

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Embodiment Construction

[0073] In order to make the above and other objects, features, and advantages of the present invention more comprehensible, preferred embodiments of the present invention will be exemplified below in detail with reference to the accompanying drawings. Furthermore, the directional terms mentioned in the present invention, such as "up", "down", "front", "rear", "left", "right", "inside", "outside" or "side", etc., It is only with reference to the direction of the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0074] Figure 1a and 1b It is a flowchart of an alignment method for substrates with different dimensions and dimensions according to an embodiment of the present invention. The alignment method comprises the following steps: Step (S01), pre-calibrating the spatial positions of the two image capture units in the first waiting space and the two image capture un...

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Abstract

The invention relates to a different-space different-size substrate alignment method, which comprises: capturing actual local images of two substrates with different sizes; comparing the particular labels of the two substrates within the standard local character regions, and acquiring the particular labels of the two substrates within the actual local character regions; respectively establishing actual coordinate systems of the two substrates so as to synthesize an alignment assembly coordinate system; comparing the coordinate values of the particular labels of the two substrates within the two actual coordinate systems so as to acquire a first group of offsets, and comparing the sizes of the two substrates so as to obtain the size difference; using the first group of the offsets and the size difference to correct the coordinate value of the particular label of one of the two substrates; comparing the coordinate values of the particular labels of the two substrates so as to acquire a second group of offsets; and moving the substrate to the position compensated by the second group of the offsets.

Description

technical field [0001] The invention relates to a base material alignment method, especially a base material alignment method in different spaces and different sizes, which is suitable for the alignment of two substrates of different sizes with specific marks or specific shapes in different waiting spaces . Background technique [0002] The typical technical application of double-layer board alignment is the precise alignment of glass masks. In addition, the scope of application of double-layer board alignment technology is very wide, such as semiconductor industry, flat-panel display industry, printed circuit board industry, etc. all its fields of application. The precise alignment of the mask is the key technology of various exposure machines in the above-mentioned electronics industry. If the key technology can be mastered to reduce manufacturing costs, it will be of great help to improve international competitiveness. [0003] U.S. Patent No. US7946669 discloses a plug...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F9/00
Inventor 林崇田温志群杨骏明林世伟
Owner METAL INDS RES & DEV CENT
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