Substrate with metal layer and manufacturing method thereof

Abstract

The invention discloses a substrate with a metal layer and a manufacturing method thereof. The manufacturing method includes the following steps that S1, a metal film is attached to an insulated film substrate; S2, division lines are cut on the metal film, and division areas are formed between the adjacent division lines; S3, metal film strips on the division areas are separated from the metal film, and the substrate with the metal layer is formed, wherein the substrate comprises a first metal circuit, a second metal circuit and a middle metal circuit, and the middle metal circuit is located between the first metal circuit and the second metal circuit. The production efficiency of the substrate with the metal layer is largely improved, and the substrate is particularly suitable for an LED lamp belt.

Description

【Technical field】 [0001] The invention relates to a substrate with a metal layer and a manufacturing method thereof. 【Background technique】 [0002] LED is a light-emitting diode, a new technology developed in the middle of the 20th century. [0003] At present, LED light strips generally use LEDs to be assembled on a strip-shaped FPC (flexible circuit board) or LED wiring board. However, the production process of the currently known traditional etching ink flexible circuit board needs to go through cutting, drilling, wiring, exposure, green oil, etching, printing, electrical measurement, etc. The production process is complicated and the cost is very high. The production process that pollutes the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and the production efficiency of splicing and cutting is extremely low, about 3 meters per minute. [0004] The other process wire plate is similar to traditional cables in the pro...

AI Technical Summary

Problems solved by technology

However, the production process of the known traditional etching ink flexible circuit boards needs to go through board cutting, drilling, wiring, exposure, green oil, etching, printing, electrical testing, etc. The production process is complicated and the cost is high.

The production process that pollutes the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and requires splicing and cutting. The production efficiency is extremely low, and the production rate is about 3 meters per minute.

[0004] The other process wire plate is similar to traditional cables in the production process. Although it does not need electroplating, etching, pickling and drilling processes, it needs to press flat copper strips and then press for production. The production process is expensive. The accuracy is poor, the production capacity is extremely low (0.8 meters per minute for the metal stamping die), and the process is unstable. The copper wire is easy to shift. Risk of conduction due to breakdown

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