A double swing sprinkler

Abstract

The invention relates to the technical field of etching and developing equipment, and discloses a dual-swing spraying device used for an etching machine or a developing machine. The dual-swing spraying device comprises an upper swing spraying unit and a lower swing spraying unit which are symmetrical to each other. Each swing spraying unit comprises a guide rail perpendicular to the conveying direction of a substrate to be etched, a spraying frame and a plurality of spraying pipes, wherein the spraying frame is erected on the guide rail and does reciprocating linear motion in the direction perpendicular to the conveying direction, and the spraying pipes are movably arranged in the spraying frame at intervals. A rotating block is arranged between the guide rail and one of the two ends of each spraying pipe. One end of each rotating block is rotationally connected with the guide rail, and the other end of each rotating block is perpendicularly and axially connected with the corresponding spraying pipe in a positioning mode. According to the dual-swing spraying device, the spraying pipes movably penetrate in the spraying frame, thereby being easy and convenient to assemble and disassemble; the rotating blocks are arranged between the spraying pipes and the guide rail, the spraying pipes achieve the rotation and linear motion dual-action spraying under the effect of reciprocating linear motion of the spraying frame, the water pond effect is effectively eliminated, and etching precision and efficiency are improved.

Description

technical field [0001] The invention relates to the technical field of etching and developing equipment, in particular to a double swinging spray device used in an etching machine or a developing machine. Background technique [0002] With the rapid development of the electronics industry, the application fields of printed circuit boards (PCB) are becoming more and more extensive, which accordingly requires its related processes to meet the increasingly updated development needs. [0003] Etching is a technology that removes the substrate of a printed circuit board by chemical reaction or physical impact. Etching technology can be divided into two types: wet etching and dry etching, usually referred to as etching Also known as photochemical etching, it refers to removing the protective film of the area to be etched after exposure to plate making and development, and contacting with a chemical solution during etching to achieve the effect of dissolution and corrosion, forming...

AI Technical Summary

Problems solved by technology

[0005] The spraying device of the spraying frame in the existing etching and developing machine is mainly swinging in one direction, and its common disadvantage is that the spraying device moves linearly in one direction, which will easily cause liquid accumulation on the upper surface of the substrate, which cannot Eliminate the pool effect in the middle of the substrate surface. The so-called pool effect means that the liquid medicine is sprayed onto the substrate, and the liquid medicine that continues to be sprayed will be hindered by the original liquid accumulation of the liquid medicine, and cannot directly contact with the layer to be etched on the surface of the substrate. Contact produces a chemical reaction; the existing spray device in the etching and developing machine still has insufficient spraying uniformity, and it is easy to have a good etching effect around the substrate and uneven etching in the middle part of the substrate, so it cannot produce high-quality products. , fine and thin lines

[0006] In the spraying device of the spraying frame in the existing etching and developing machine, the spraying pipe on it is usually fixedly installed. When the spraying pipe is damaged, it is very inconvenient to disassemble, replace and maintain; in addition, the spraying device The frame around the spray frame is usually fixed by direct welding, its strength is not enough, it is easy to be damaged and loose, resulting in uneven spraying, which seriously affects the etching effect

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