An ultrasonic spray device

Abstract

In order to solve the problems that in the prior art, when scaling powder is sprayed to circuit boards of different sizes, operation is tedious, and the scaling powder is wasted, the invention provides ultrasonic spraying equipment. The ultrasonic spraying equipment comprises a frame, an electric box, an atomizing component and a spraying component. The atomizing component comprises a groove with an atomizing groove body and a plurality of ultrasonic generators; the ultrasonic generators are fixed to the bottom of the atomizing groove body; the spraying component comprises a spraying base body, and a plurality of spraying cavities which are separated from one another are formed in the spraying base body; and micro spraying openings are formed in the top end of the spraying base body by the spraying cavities. The spraying base body is arranged on the groove, and the lower portions of the spraying cavities are arranged in the atomization groove body; each ultrasonic generator right faces the bottom of one or multiple mist spraying cavities, and an independent spraying unit is formed; the atomization component and the spraying component are arranged in the frame; and the electric box is connected with fans and the ultrasonic generators, and each fan and each ultrasonic generator are independently controlled to be started or stopped. The ultrasonic spraying equipment sprays the scaling powder to the circuit boards of the different sizes, operation is convenient, and the scaling powder cannot be wasted.

Description

technical field [0001] The invention relates to an ultrasonic spray device. Background technique [0002] In the wave soldering process, traditional flux sprays generally use air pressure or electromagnetic waves to atomize the flux, and then spray it onto the circuit board through a specific moving nozzle. When using the above technology to spray flux, the atomized flux particle size is relatively coarse and the particle size distribution is uneven; affected by the movement of the circuit board and the nozzle, the flux sprayed on the circuit board cannot be uniform. This will have a huge impact on the quality of the soldering and waste a lot of flux. [0003] There is a foreign technology of using flux to atomize through an ultrasonic nozzle, and the atomization speed depends on the speed at which the flux is introduced into the nozzle. One technique utilizing ultrasonic nozzles involves the use of moderate pressure compressed air or nitrogen to shape the spray as it emer...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide an ultrasonic spraying device for circuit boards of different sizes in the prior art, which requires frequent adjustment of the coating area when coating flux, cumbersome operation, and easy waste of flux

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