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Chip electronic component and method for manufacturing chip electronic component

A technology of electronic components and chips, applied in the manufacture of inductors/transformers/magnets, electrical components, inductors with magnetic cores, etc., and can solve problems such as the limitation of inductance L value variation characteristics

Active Publication Date: 2017-09-29
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] The following related art documents disclose film-type chip inductors in which internal coil patterns are formed on the upper and lower surfaces of an insulating substrate by plating, but there is a limit in improving the change characteristics of the inductance L value with the application of current. The problem

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  • Chip electronic component and method for manufacturing chip electronic component
  • Chip electronic component and method for manufacturing chip electronic component
  • Chip electronic component and method for manufacturing chip electronic component

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Embodiment Construction

[0031] Exemplary embodiments of the present disclosure will now be described in detail with reference to the accompanying drawings.

[0032] This disclosure may, however, be illustrated in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0033] In the drawings, the shapes and dimensions of elements may be exaggerated for clarity, and the same reference numerals will be used throughout to designate the same or like elements.

[0034] chip electronic components

[0035] Hereinafter, a chip electronic component such as a thin film type inductor according to an exemplary embodiment of the present disclosure will be described, but the present disclosure is not limited thereto.

[0036] figure 1 is a schematic perspective view showing a chip electron...

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Abstract

The invention discloses a chip electronic component and a manufacturing method thereof. The chip electronic component comprises a magnetic main body comprising an insulation substrate; an internal coil part arranged on at least one face of the insulation substrate; and an external electrode arranged on one end surface of the magnetic main body and connected to the internal coil part. The thickness of the insulation substrate is defined as t1 and the thickness of the internal coil part is defined as t2, wherein t2 / t1 is 0.1-0.8. The chip electronic component is capable of preventing magnetization from occurring around a coil by stopping flowing around the coil so as to improve variation characteristics of inductance L value along with imposing of current and capable of achieving relative high maximum inductance by fundamentally ensuring size of filled magnetic materials.

Description

[0001] This application claims the benefit of Korean Patent Application No. 10-2014-0000139 filed in the Korean Intellectual Property Office on Jan. 2, 2014, the contents of which are hereby incorporated by reference. technical field [0002] The present disclosure relates to a chip electronic component and a method of manufacturing a chip electronic component. Background technique [0003] Inductors (ie, chip electronic components) are representative passive components that construct electronic circuits together with resistors and capacitors to remove noise. Inductors combine electromagnetic properties with capacitors to construct resonance circuits or filter circuits that amplify signals in specific frequency bands. [0004] Recently, since the miniaturization and thinning of information technology (IT) devices such as various communication devices and display devices have been accelerated, the Research on techniques for miniaturization and thinning of various components ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F17/04H01F27/28H01F41/00
CPCH01F10/28H01F17/0013H01F27/292H01F27/346H01F41/02
Inventor 朴文秀李东焕韩珍玉金珆映车慧娫
Owner SAMSUNG ELECTRO MECHANICS CO LTD