Defect detecting method for junction surface of metal alloy

A metal alloy, defect detection technology, applied in the direction of using sound wave/ultrasonic wave/infrasonic wave to analyze solids, etc., can solve technical difficulties and other problems

Inactive Publication Date: 2015-07-15
SOUTH CHINA UNIV OF TECH
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Problems solved by technology

Due to the limitation of the characteristics of the metal alloy itself, ultrasonic testin

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  • Defect detecting method for junction surface of metal alloy
  • Defect detecting method for junction surface of metal alloy
  • Defect detecting method for junction surface of metal alloy

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Embodiment Construction

[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the embodiments and accompanying drawings.

[0027] see figure 1 , the present embodiment provides a metal alloy bonding surface detection method, the method comprising the following steps:

[0028] Step 10: Use the mixed frequency signal to excite the defects at the joint surface of the metal alloy through dual-channel excitation-single-channel receiving detection;

[0029] Active stress wave detection technology and nonlinear modulation guided wave technology are adopted. Both the sending and receiving sensors use PZT transducers with positive and negative piezoelectric effects. Taking the metal structure of cast alloy pipe inside as an example, the dotted line is the alloy joint surface of the buried pipe , the outer layer is metal copper, the inner layer is metal nickel aluminum alloy, a...

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Abstract

The invention discloses a defect detecting method for a junction surface of metal alloy. The defect detecting method for the junction surface of the metal alloy includes the steps that a frequency mixing signal is adopted to receive and detect defect dual channel incentive-single channel at the junction surface of the metal alloy; a low-frequency component in the frequency mixing signal is eliminated through a high-pass filter, and a high-frequency component in the frequency mixing signal is eliminated through a band-pass filter, and a nonlinear sidelobe component is obtained through the low-frequency component and the high-frequency component; synchronous demodulation of the nonlinear sidelobe component is achieved through the high-frequency component, the high-frequency part is filtered, and the nonlinear base band component generated in the defect at the junction surface is retained; wavelet analysis is performed on the nonlinear base band component to obtain a wavelet energy value of the nonlinear base band component, and whether the junction surface of the metal alloy exists defects or not is judged according to the wavelet energy value; the positioning of a defect position is achieved through nonlinear acoustic same-side excitation frequency mixing positioning method according to nonlinear sidelobe component wavelet energy values of different delayed moments.

Description

technical field [0001] The invention relates to the fields of testing and measurement technology and structural health monitoring, in particular to a method for detecting defects on a metal alloy bonding surface. Background technique [0002] Bonded metal alloys have developed rapidly in recent years, and their application ranges are becoming wider and wider. Because of the good performance and designability of the structure, the bonded metal alloy is widely used in the fields of mechanical power, transportation, power electronics, military industry, and instrumentation industry. With the continuous development of the metal alloy industry, the testing methods of components have been continuously improved. Advanced non-destructive testing methods can detect flaws on components without damaging the structure and characteristics of the material itself, especially ultrasonic testing has been applied to the field of joining metal alloys. Due to the limitation of the characteris...

Claims

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Application Information

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IPC IPC(8): G01N29/04
Inventor 洪晓斌冯进亨
Owner SOUTH CHINA UNIV OF TECH
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