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MEMS microphone packaging structure and manufacturing method thereof

A technology of packaging structure and manufacturing method, which is applied to semiconductor devices, sensors, electrostatic transducer microphones, etc., can solve the problems of increasing the manufacturing process, which is not conducive to the development of MEMS microphone miniaturization, etc. Efficient effect

Inactive Publication Date: 2015-07-15
GOERTEK INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Such a connection method not only increases the production process, but also is not conducive to the miniaturization of MEMS microphones.

Method used

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  • MEMS microphone packaging structure and manufacturing method thereof
  • MEMS microphone packaging structure and manufacturing method thereof
  • MEMS microphone packaging structure and manufacturing method thereof

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Embodiment Construction

[0030] Various exemplary embodiments of the present invention will now be described in detail with reference to the accompanying drawings. It should be noted that the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise.

[0031] The following description of at least one exemplary embodiment is merely illustrative in nature and in no way taken as limiting the invention, its application or uses.

[0032] Techniques, methods and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, such techniques, methods and devices should be considered part of the description.

[0033] In all examples shown and discussed herein, any specific values ​​should be construed as exemplary only, and not as limitations. Therefore, other instances of the exemplary embodiment may have dif...

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Abstract

The invention discloses an MEMS microphone packaging structure and a manufacturing method thereof. The MEMS microphone packaging structure comprises a closed space formed by a circuit board and a cover plate in a surrounding manner and further comprises energy converters and an amplifier, wherein the energy converters and the amplifier are arranged in the closed space, welded on the circuit board by placing solder balls, and electrically connected together through a layout in the circuit board; seals are also arranged between the energy converters and the circuit board; a voice port is formed in a position, corresponding to the energy converters, on the circuit board. According to the MEMS microphone packaging structure disclosed by the invention, both the energy converters and the amplifier are welded on the circuit board by placing the solder balls, so that the energy converters and the amplifier can be electrically connected together through the circuit board; for such a connection structure, , no gold thread is needed for the connection, so that the height of the whole packaging structure can be reduced, and the packaging structure can be thinner to satisfy the light and thin development requirements of products; meanwhile, the packaging structure is simple in production process, high in process efficiency and low in production cost.

Description

technical field [0001] The invention relates to a microphone, which belongs to the field of acoustic-electric conversion, and more specifically, relates to a packaging structure of a MEMS microphone; the invention also relates to a manufacturing method of the packaging structure. Background technique [0002] MEMS (Micro-Electro-Mechanical Systems) microphones are microphones manufactured based on MEMS technology. The diaphragm and back plate are important components of the MEMS microphone. conversion. [0003] In recent years, with the development of science and technology, the volume of electronic products such as mobile phones and notebook computers has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which requires the supporting electronic components The volume of must also decrease accordingly. [0004] Existing MEMS microphones include a packaging structure surrounded by a circuit board and...

Claims

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Application Information

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IPC IPC(8): H04R19/04H04R31/00
CPCH01L2924/15151H01L2924/16152
Inventor 刘文涛吴安生
Owner GOERTEK INC