A fully automatic pcb vertical continuous electroplating device

A vertical continuous electroplating and fully automatic technology, applied in the direction of electrolysis process, electrolysis components, etc., can solve the problems of serious environmental pollution, large amount of waste water, complicated operation, etc., achieve high conductivity reliability, reduce production and operation costs, and facilitate operation Effect

Active Publication Date: 2017-09-12
栾善东
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The nitric acid system is often used in the deplating process, which is not only dangerous, but also complicated to operate, causing serious environmental pollution and a large amount of waste water

Method used

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  • A fully automatic pcb vertical continuous electroplating device
  • A fully automatic pcb vertical continuous electroplating device
  • A fully automatic pcb vertical continuous electroplating device

Examples

Experimental program
Comparison scheme
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Embodiment Construction

[0055] The present invention is described below in conjunction with accompanying drawing:

[0056] like Figure 1-10 As shown, in the middle part of each electroplating copper cylinder, the tank walls on both sides are used as the back baffle of the middle anode chamber 1, and four side risers 103 at equal intervals are welded on the groove walls, and the two sides of the middle chamber are placed on the side risers. 103 leaves a certain distance from the groove wall to weld the back baffle 104, and leaves a certain distance to weld the bottom plate 105 from the bottom of the groove. The space left is used as the overflow channel 4, and the groove wall is provided with an overflow port and a side vertical plate There are slots on both sides of 103 for the insertion of diaphragm inserting plate 102. After insertion, fluorine rubber sealing strips are used to squeeze in and seal to form several independent anode chambers 1. Holes are opened on the inner vertical plate 103 of eac...

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PUM

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Abstract

The invention discloses a novel full-automatic PCB vertical continuous electroplating device, comprising: automatic feeding, chain transmission, pre-processing, electroplating, post-processing and automatic unloading. The electroplating copper cylinder adopts an independent anode chamber structure, lower auxiliary chain clamping, side spray and height-adjustable bottom spray, guide members, independent slider connection fixtures and guide and conductive structures, and rubber-sealed conductive chucks to prevent stripping; chain Transmission adopts push spring type tension adjustment. The beneficial effects of the present invention are: the independent anode chamber completely separates the anolyte and the catholyte, completely prevents the anode slime from entering the catholyte to affect the electroplating quality, eliminates or significantly reduces the burden of filtration, and greatly reduces the consumption of additives; The strip-free process simplifies the process and enables double-row operation to increase productivity.

Description

technical field [0001] The invention belongs to the technical field of electroplating, in particular to a full-automatic PCB vertical continuous electroplating (VCP) production line. Background technique [0002] In order to meet the needs of line connection in the process, copper plating is usually carried out on the whole board of through holes, blind holes and filled holes. Vertical continuous electroplating (VCP) is a relatively advanced continuous electroplating method newly developed in the industry in recent years. More and more people in the industry have abandoned rack plating and adopted VCP. It uses continuous processing, automatic loading and unloading and other means to overcome hanging Insufficient plating, good plating uniformity and high efficiency and automation. However, the vertical continuous electroplating line of the prior art still has a large amount of solution circulation, a heavy burden of filtration, a large consumption of additives, the conductiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C25D19/00C25D7/00C25D17/00C25D17/06
Inventor 栾善东栾光邈
Owner 栾善东
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