Semiconductor radiator

Abstract

A semiconductor radiator comprises a hollow heat-separation platform (2) and a lower heat-conducting connection base (3) disposed separately on an upper end surface and a lower end surface of a through hole of a hard insulation heat-separation substrate (1). The lower heat-conducting connection base (3) is provided with a boss that penetrates through the through-hole and is fitted to the cavity of the hollow heat-separation platform. The top surface of the boss is attached to the bottom surface of a semiconductor cooling piece (5) disposed on the top portion of the hollow heat-separation platform. An upper heat-conducting connection base (6) is attached to the top surface of the semiconductor cooling piece. The semiconductor radiator has effects of preventing dust and integrally dissipating heat, and improves the heat dissipation efficiency.

Description

technical field [0001] The invention relates to a device for dissipating heat by utilizing the refrigeration effect of a semiconductor refrigeration sheet in the application field of a semiconductor refrigeration sheet. Background technique [0002] Because of its structure and design principles, the current popular semiconductor radiators all have the defects of poor heat insulation at the cold and hot ends, unfavorable dust isolation, and difficult installation and use. In many electronic devices, due to the use of heat dissipation devices such as multiple fans, a large amount of dust enters the interior of the device along with the heat dissipation wind. If it is not cleaned in time, it is easy to cause air duct blockage, temperature rise, circuit short circuit, etc. And other problems, which in turn lead to high failure rate, causing or burning equipment or sudden shutdown and other failures or accidents, but in fact, auxiliary devices such as fans can also be regarded a...

AI Technical Summary

Problems solved by technology

[0002] Because of its structure and design principles, the popular semiconductor radiators have the defects of poor heat insulation at the cold and hot ends, not conducive to dust isolation, and not easy to install and use.

In many electronic devices, due to the use of heat dissipation devices such as multiple fans, a large amount of dust enters the interior of the device along with the heat dissipation wind. If it is not cleaned in time, it is easy to cause air duct blockage, temperature rise, circuit short circuit, etc. And other problems, which in turn lead to high failure rate, causing or burning equipment or sudden shutdown and other failures or accidents, but in fact, auxiliary devices such as fans can also be regarded as one of the sources of failure, and these electronic devices equipped with fans are in While dissipating heat, it also emits a lot of noise, which has a negative impact on many environments that require noise-free work, audio and video, etc.

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