Inverter Module And Integrated-inverter Electric Compressor

Abstract

An object is to provide an inverter module that can ensure satisfactory anti-vibration strength, moisture resistance, and isolation for each of the upper and lower boards of the inverter module and that can reduce the weight and cost, and to provide an integrated-inverter electric compressor. In an inverter module (21) in which a power system board (23) and a control board (31) are integrated via a resin case (22), the inverter module (21) is configured such that the power system board (23), on which a semiconductor switching device (24) is mounted, is provided at the lower part of the resin case (22) and the control board (31), on which a control-and-communication circuit is mounted, is provided thereabove. In the resin case (22), a thermosetting resin (36) is filled to a height position where the top surface of the power system board is covered (23), so that the power system board (23) is encapsulated in the resin, and a gel-like resin material (38) is filled from a resin-encapsulated surface (37) to a height position where a part of the control board (31) is covered.

Description

[0001] This application is a divisional application for an invention patent application with an application date of February 25, 2010, an application number of 201080002518.9, and an invention title of "inverter module and inverter integrated electric compressor". Technical field [0002] The present invention relates to an inverter module and an inverter-integrated electric compressor suitable for use in a vehicle air conditioner in which an inverter device is integrated into a housing of an electric compressor. Background technique [0003] As a compressor for an air-conditioning device installed in a hybrid vehicle, an electric vehicle, etc., an inverter-integrated electric compressor in which an inverter device is integrated is known. The inverter-integrated electric compressor is usually provided with an inverter housing (inverter box) on the outer periphery of a housing containing a motor and a compression mechanism, and an inverter device is installed in the inverter housing...

AI Technical Summary

Problems solved by technology

However, the techniques shown in Patent Documents 1 to 3 all form a structure in which a gel-like resin material is filled on the surface of a power-system substrate on which a semiconductor switching element is mounted. , but there is still a problem that high reliability and stable vibration resistance cannot be ensured against high thermal cycles, thermal shocks, vibrations, etc.

[0010] In the structure in which the entire interior of the inverter housing is filled with a gel-like resin material, the amount of heavy and expensive gel-like resin material used increases. It is difficult to be called an appropriate solution for the integrated electric compressor

In addition, as shown in Patent Document 3, when the upper control board (CPU board) is resin-sealed, not only is it difficult to maintain the lower power system board, but the control board itself is actually difficult to maintain.

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