MEMS (Micro-Electro-Mechanical System) pressure sensor-MEMS inertial sensor integrated structure

Abstract

The invention discloses an MEMS (Micro-Electro-Mechanical System) pressure sensor-MEMS inertial sensor integrated structure. The integrated structure comprises an insulating layer formed on a substrate, a first lower electrode and a second lower electrode formed on the insulating layer, a first upper electrode which constructs an air-pressure-sensitive capacitor with the first lower electrode, a second upper electrode which constructs a reference capacitor with and the second lower electrode, an inertial sensitive structure supported above the substrate through a third support part, a fixed polar plate which constructs an inertial detection capacitor of the inertial sensor with the inertial sensitive structure, and a cover body for encapsulating the inertial detection capacitor constructed by the inertial sensitive structure and the fixed polar plate on the substrate. According to the integrated structure, the MEMS inertial sensor and the MEMS pressure sensor are integrated on the same substrate, and the area of a chip can be lowered effectively, so that the cost of the chip is lowered. The encapsulation of the whole chip can be finished through one-time encapsulation, so that the cost of chip encapsulation is lowered.

Description

technical field [0001] The invention relates to the field of sensors, more specifically, to an integrated structure integrating a MEMS pressure sensor and a MEMS inertial sensor on the same chip. Background technique [0002] In recent years, with the development of science and technology, the volume of electronic products such as mobile phones and notebook computers has been continuously reduced, and people have higher and higher performance requirements for these portable electronic products, which requires the supporting electronic components The volume must also be reduced accordingly. [0003] As a measuring device, sensors have been widely used in electronic products such as mobile phones and notebook computers. In the existing process structure, due to the different detection principles, the MEMS inertial sensor and the MEMS pressure sensor chip are generally separated. Contact, the two devices are designed and processed based on different process platforms, and the...

AI Technical Summary

Problems solved by technology

During assembly, the system manufacturer mounts the MEMS inertial sensor chip and the MEMS pressure sensor chip on the same motherboard by SMT, which increases the cost of the chip and the cost of the package.

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