Camera module bracket and camera module with same

Abstract

The invention discloses a camera module support and a camera module with the camera module support. The camera module support comprises a support body provided with a though hole penetrating the support body in the thickness direction of the support body; a first sidewall part arranged on the periphery of the support body and encircling the through hole; and a second sidewall part arranged on the support body and located between the first sidewall part and the through hole. The camera module support has a relatively independent inner installation space and a relatively independent external installation space; the peripheral wall of a voice coil motor is opposite to the second sidewall; an image sensing chip is installed in inner installation space, and more electronic components can be installed in the external installation space, thereby preventing dust and chippings from entering an image sensing area of the image sensing chip so as to reduce influence to imaging, and effectively preventing the electronic components in the external installation space from water vapor corrosion and dust pollution.

Description

technical field [0001] The invention relates to the field of imaging technology, in particular to a camera module bracket and a camera module with the same. Background technique [0002] The image sensor chip and electronic components in the traditional camera module are all arranged on the circuit board and accommodated in the inner cavity of the camera module bracket. Since the electronic components are arranged around the image sensor chip, glue is drawn on the production line. When the rubber needle hits the electronic components, there will be a risk of hitting the electronic components. Once it hits the electronic components, a lot of debris will be generated, which is difficult to eliminate and will affect the image quality in severe cases. Moreover, particles and impurities are easy to hide between the electronic components and the capacitive conductive sheet on the circuit board. When the camera of the mobile phone is shaken, the particles and impurities may fall in...

AI Technical Summary

Problems solved by technology

[0002] The image sensor chip and electronic components in the traditional camera module are all arranged on the circuit board and accommodated in the inner cavity of the camera module bracket. Since the electronic components are arranged around the image sensor chip, glue is drawn on the production line. When the rubber needle hits the electronic components, there will be a risk of hitting the electronic components. Once it hits the electronic components, a lot of debris will be generated, which is difficult to eliminate and will affect the image quality in severe cases.

Moreover, particles and impurities are easy to hide between the electronic components and the capacitive conductive sheet on the circuit board. When the camera of the mobile phone is shaken, the particles and impurities may fall into the image sensing area of ​​the image sensor chip and seriously affect the imaging effect.

Moreover, as the functions of the camera module increase, such as the anti-shake function, the corresponding electronic components also increase accordingly. The existing bracket structure can only accommodate a part of the electronic components, while the other part can only be directly exposed around the bracket, which cannot effectively prevent Water vapor corrosion and dust pollution

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