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Manufacturing method of semiconductor device

A manufacturing method and semiconductor technology, applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electric solid-state devices, etc., can solve the problems of stacking method damage, poor packaging yield, etc., and achieve the effect of improving yield

Active Publication Date: 2018-01-19
EXCEL CELL ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Due to the alignment accuracy and operation method of the existing semiconductor device manufacturing method, the predetermined stacking method between the components is often destroyed, resulting in the problem of poor packaging yield

Method used

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  • Manufacturing method of semiconductor device
  • Manufacturing method of semiconductor device
  • Manufacturing method of semiconductor device

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Embodiment Construction

[0027] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0028] Before the present invention is described in detail, it should be noted that in the following description, similar components are denoted by the same numerals.

[0029] refer to figure 1 , which is a first embodiment of the manufacturing method of the semiconductor device of the present invention, the steps include: Step (A) 100 provides a pin unit positioned by a frame. Step (B) 200 provides a semiconductor chip, and the semiconductor chip is disposed on one of the pins of the pin unit and electrically connected. Step (C) 300 provides a conductive sheet, and electrically connects the conductive sheet to another pin of the pin unit and the semiconductor chip. Step (D) 400 performs a sealing procedure. Step (E) 500 separates the pin unit from the frame. Step (F) 600 bending procedure. Next, the above steps will be described in detail later....

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PUM

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Abstract

A method for manufacturing a semiconductor device, comprising the following steps: (A) providing a pin unit positioned by a frame, the pin unit having a first pin and a second pin arranged at intervals, the second The pin has a limiting portion adjacent to the first pin; (B) providing a semiconductor chip and setting the semiconductor chip on the first pin and electrically connecting it; (C) providing a conductive sheet and connecting it with the first pin The second pin is electrically connected to the semiconductor chip, and the conductive sheet has a limited portion that can be engaged and limited by the limiting portion of the second pin; (D) glue sealing process; and (E) The pin unit is separated from the frame. By engaging the conductive sheet with the limiting part of the second pin, the conductive sheet can not deviate from the predetermined installation position due to sliding when installing the conductive sheet, thereby improving the yield rate of packaging.

Description

technical field [0001] The invention relates to a method for manufacturing a device, in particular to a method for manufacturing a semiconductor device. Background technique [0002] The existing manufacturing method of a semiconductor device is to provide two spaced pins first, then electrically connect a semiconductor chip to one of the pins, and then provide a conductive sheet, and the two opposite sides of the conductive sheet The terminals are attached and electrically connected to the semiconductor chip and another pin respectively, and finally the sealing process is performed to complete a semiconductor device. [0003] However, when the conductive sheet is subjected to the above-mentioned electrical connection step, due to the poor alignment accuracy, the conductive sheet often deviates from the predetermined electrical connection position, resulting in too small overlapping surface, and even slipping out of the semiconductor chip. If it is connected to the pins loc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/56H01L21/60
CPCH01L24/97H01L2224/40245H01L2924/181H01L2224/40095H01L2224/37011H01L2924/00014H01L2224/40H01L2224/84385H01L2224/84H01L2224/32245H01L24/84H01L24/77H01L2924/00012H01L2224/37099
Inventor 孙智信
Owner EXCEL CELL ELECTRONICS