Apparatus and method for continuous processing of semiconductor wafer
A processing device and semiconductor technology, applied in semiconductor/solid-state device manufacturing, transportation and packaging, electrical components, etc., can solve the problems of wafers that can no longer maintain isolation, reduction, poor process, etc., to prevent poor process, reduce The effect of power consumption and extended maintenance cycle
Inactive Publication Date: 2015-09-16
SUBARU TECNICA INTERNATIONAL
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[0013] But in this case, the wafer can no longer maintain the isolated state, and the wafer is exposed in the outer space of the isolated chamber.
Therefore, if the wafer is exposed to the outside space after the heating process is completed, the temperature of the wafer will drop until the next chamber process is performed, causing process failure
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[0077] A continuous semiconductor wafer processing apparatus according to an embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
[0078] figure 1 is a generalized plan view of a continuous processing device for semiconductor wafers according to a preferred embodiment of the present invention, figure 2 Yes figure 1 A general cross-sectional view of the A-A direction in the middle, image 3 It is a detailed cross-sectional structure diagram of the mounting ring 720 suitable for the present invention.
[0079] refer to figure 1 and figure 2 , the continuous semiconductor wafer processing device according to the embodiment of the present invention includes the first to fifth chambers 100 , 200 , 300 , 400 , 500 arranged in a circle based on the center of the outer body 600 .
[0080] The outer body 600 includes: a disc-shaped lower plate 610; a disc-shaped upper plate 620 located on the upper side of the lower ...
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The present invention relates to an apparatus and a method for continuous processing of a semiconductor wafer, in which the apparatus comprises a plurality of chambers to process a wafer through multiple steps, one or more chambers from among the plurality of chambers comprising: a susceptor fixedly disposed to support the water during the execution of the steps; a lower housing fixedly disposed outside of the susceptor so as to form a segregated processing space on the lower part of the wafer; an upper housing moving vertically so as to create a segregated processing space on the upper part of the wafer; a turn-table provided between the upper and lower housings and having a hole for exposing the upper part of the susceptor, and rotating to transport the wafer from in between the plurality of chambers and to vertically move the wafer from the upper part of the susceptor; and a seating ring on which the wafer is seated by being inserted into the hole so as to allow a vertical removal thereof, and thus the present invention simplifies the structure of the apparatus and can reduce energy consumption.
Description
technical field [0001] The present invention relates to an apparatus and method for continuous processing of semiconductor wafers, and more particularly, to a continuous processing apparatus and method for semiconductor wafers which reduces the number of chambers and can simplify the isolation structure of each chamber. Background technique [0002] Generally, equipment for performing semiconductor post-process - reflow has a plurality of isolated chambers due to the different levels of atmosphere and temperature in each process stage. In order to enable continuous processes between these chambers, it is necessary to There are means for transferring semiconductor wafers. [0003] In particular, a plurality of chambers are formed in a circular shape, and in order to sequentially transfer the loaded semiconductor wafers to the chambers, an equipment having a turntable passing through the respective chambers has been developed. [0004] Such equipment is described in detail in...
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IPC IPC(8): H01L21/677
CPCH01L21/67173H01L21/68771H01L21/68764H01L21/6719
Inventor 李元求徐现模安贤焕柳守烈崔宇鎭
Owner SUBARU TECNICA INTERNATIONAL