Heat dissipation module manufacturing method and heat dissipation module

Abstract

The invention provides a heat dissipation module manufacturing method and a heat dissipation module. According to the heat dissipation module manufacturing method and the heat dissipation module, heat dissipation fins (3) and a substrate (2) are of a separated structure, a plurality of heat dissipation fins (3) are arranged on the substrate (2), and a plurality of heat pipes (1) are pressed into a containing groove (24) in the substrate (2), so that the heat pipes (1), the substrate (2) and the heat dissipation fins (3) are tightly fixed together, welding is not needed, the process is simple, and the heat dissipation effect is good; meanwhile, the thickness of the heat dissipation fins (3), the area of the substrate (2) and the distance between the heat dissipation fins (3) can be reduced, the distribution density of the heat dissipation fins (3) is increased, the production cost is saved, and the theoretical heat dissipation area is increased; accordingly, the overall heat dissipation efficiency of the heat dissipation module is improved on the basis that the production cost is lowered.

Description

technical field [0001] The invention relates to the technical field of heat dissipation, in particular to a method for manufacturing a heat dissipation module and the heat dissipation module. Background technique [0002] With the development of the electronic industry, the working speed of electronic components is increasing day by day, and the heat generated by them is also increasing accordingly. In order to make the electronic components operate at high speed, the heat generated by them needs to be discharged as soon as possible, otherwise the electronic components cannot work normally. Work, or even be burned by high temperature. At present, the commonly used heat dissipation method is to install a heat dissipation module on the electronic components that generate heat. The heat dissipation module generally includes a substrate, a plurality of heat dissipation fins, and heat pipes that run through the plurality of heat dissipation fins. The heat is transmitted to the h...

AI Technical Summary

Problems solved by technology

[0003] The existing method of fastening and fitting connection between cooling fins and heat pipes is generally complex in structure, difficult to process, and is not conducive to cost control, or the production process requires custom-made special molds and fixtures, which increases production costs and lower output

In addition, the existing method of fastening and fitting connection between the heat dissipation fins and the heat pipes generally requires the substrate and the heat dissipation fins to be integrally formed. More materials are used, and the production cost is further increased

At the same time, due to the integral molding of the base plate and the heat dissipation fins, the gap between the heat dissipation fins is wider, and the distribution density of the heat dissipation fins is lower, thereby reducing the theoretical heat dissipation area, which in turn affects the overall heat dissipation performance of the heat dissipation module.

[0004] The method of welding heat dissipation fins and heat pipes is generally complicated in production process, requiring additional soldering links, and the cost is high; and the production process generally adopts assembly line operations, which consumes man-hours

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