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Method for predicting nickel base alloy high temperature flow stress and dynamic recrystallization behavior

A nickel-based alloy, flow stress technology, applied in the field of nickel-based alloy processing engineering, can solve problems such as difficult engineering applications and narrow application ranges

Inactive Publication Date: 2015-09-23
CENT SOUTH UNIV
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Problems solved by technology

[0004] The purpose of the present invention is to provide a method for predicting high-temperature flow stress and dynamic recrystallization behavior of nickel-based alloys, which solves the disadvantages of narrow application range of existing prediction methods and is difficult to realize engineering applications, and is helpful for rationally formulating nickel-based alloy thermal processing technology It has important technical guiding significance

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  • Method for predicting nickel base alloy high temperature flow stress and dynamic recrystallization behavior
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  • Method for predicting nickel base alloy high temperature flow stress and dynamic recrystallization behavior

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Embodiment Construction

[0028] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] The present invention is a method for predicting high-temperature flow stress and dynamic recrystallization behavior of nickel-based alloys. The following takes the prediction of high-temperature flow stress and dynamic recrystallization behavior of GH4169 alloy (a typical nickel-base alloy) as an example to introduce the present invention in detail Specific implementation details of the forecasting methods involved, including:

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Abstract

The invention discloses a method for predicting nickel base alloy high temperature flow stress and a dynamic recrystallization behavior. The method comprises the following steps: 1 obtaining true stress-true strain data of nickel base alloy by means of high temperature compression tests; 2 establishing a unified constructive model for predicting the nickel base alloy high temperature flow stress and the dynamic recrystallization behavior; 3 utilizing the numerical value difference principle, writing an iterative accumulation algorithm program, inserting numerical value simulation software, and by combining the true stress-true strain data of the nickel base alloy, determining material parameters of the unified constructive model for predicting the nickel base alloy high temperature flow stress and the dynamic recrystallization behavior; 4 predicting the nickel base alloy high temperature flow stress and the dynamic recrystallization behavior under the constant temperature and constant strain rate condition as well as under the variable temperature and variable strain rate condition. By means of the method, the nickel base alloy high temperature flow stress and the dynamic recrystallization behavior under the constant temperature and constant strain rate condition as well as under the variable temperature and variable strain rate condition can be predicted rapidly and accurately, and important technical guidance significance for formulating the nickel base alloy hot working process reasonably is achieved.

Description

Technical field: [0001] The invention belongs to the technical field of nickel-based alloy processing engineering, in particular to a method for predicting high-temperature flow stress and dynamic recrystallization behavior of nickel-based alloys. Background technique: [0002] During the thermal processing of nickel-based alloys, the thermal deformation process of nickel-based alloys can usually be divided into two stages: elastic deformation and plastic deformation. The elastic deformation phase of nickel-based alloys can usually be accurately described by Hooke's law. When the applied load exceeds the yield stress of the nickel-based alloy, the plastic deformation of the nickel-based alloy begins to occur on a macroscopic scale, and the dislocation movement process inside the nickel-based alloy appears on a microscopic scale. The work hardening behavior caused by the generation and proliferation of dislocations further promotes the increase of the true stress of nickel-b...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22F1/10
Inventor 蔺永诚温东旭
Owner CENT SOUTH UNIV
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