Test device for testing creep of metal materials under low stress

A metal material, creep test technology, applied in the direction of measuring devices, analysis materials, instruments, etc., can solve the problems that cannot meet the requirements of higher precision testing

Inactive Publication Date: 2015-09-23
TIANJIN UNIVERSITY OF TECHNOLOGY
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the existing uniaxial creep test method cannot meet the

Method used

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  • Test device for testing creep of metal materials under low stress
  • Test device for testing creep of metal materials under low stress
  • Test device for testing creep of metal materials under low stress

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Embodiment

[0025] Such as figure 1 The creep test device for testing metal materials under low stress is shown, the device mainly includes: main frame 1, non-contact optical measurement system 2, sample fixture 6, window-type high-temperature furnace 7, spiral sample 8, fixed Frame components, computer 5, connecting wire 4, etc.; wherein, the main frame adopts a double-column portal frame structure, and the window-opening high-temperature furnace is fixedly installed on one side column of the main frame through a side mounting bracket. The spiral sample is installed on the sample fixture, and the sample fixture is installed at the center of the upper beam of the main frame, and ensures that the spiral sample is placed at the center of the window-type high-temperature furnace; the non-contact optical measurement system includes a receiver , Transmitter, display and connecting wires, the transmitter and receiver are respectively installed on the fixed frame assembly, the fixed frame assem...

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Abstract

The invention discloses a test device for testing creep of metal materials under a low stress. According to a traditional uni-axial creep test device, due to the fact that the strain resolution ratio is low, so that the creep test demand of the metal materials under the low stress cannot be met. The test device for testing the creep of the metal materials under the low stress is based on a pure torsional deformation principle, a sample to be tested is processed into a spiral-shaped sample, a certain temperature and a small loading are imposed, a non-contact type optical measuring system is used to test the elongation of a screw pitch of the sample with the increase of time, and therefore the creep property of the metal materials under the low stress is researched. The test device comprises a main rack, the non-contact optical measuring system, a sample fixture, an open-window type high-temperature furnace, a spiral sample, a fixed support component, a computer and a connecting wire. Low-stress creep data tested by the test device for testing the creep of the metal materials under the low stress can provide a reference for safety evaluation and life forecast of pipelines of a nuclear power plant and a heat-engine plant.

Description

Technical field: [0001] The invention relates to a creep test device for metal materials under low stress, in particular to a creep evaluation device for heat-resistant steel under high temperature and low stress. Background technique: [0002] The service life of the high-temperature part of thermal power and nuclear power plants is required to be more than 20 years, and the deformation should not exceed 1%, so the creep rate of the heat-resistant materials used will be lower than 10 -10 / s, that is, creep occurs under low stress. Traditional creep test methods use uniaxial tensile tests and sensors to measure elongation. Since this experimental method is based on tensile deformation, the measured deformation rate is relatively low, generally at 10 -6 ~10 -5 / s, it cannot meet the higher precision test requirements for creep under low stress, such as Figure 9 shown. Invention content: [0003] The purpose of the present invention is to solve the problem that the exist...

Claims

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Application Information

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IPC IPC(8): G01N3/00
Inventor 赵鹏硕申俊杰
Owner TIANJIN UNIVERSITY OF TECHNOLOGY
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