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Substrate processing apparatus and substrate processing method

A technology for a substrate processing device and a substrate processing method, applied in cleaning methods and tools, chemical instruments and methods, cleaning methods using liquids, etc., capable of solving problems such as increased consumption of processing liquids, deterioration of processing uniformity, contamination or stains, etc. , to achieve the effect of reducing the consumption of treatment liquid and suppressing poor treatment

Active Publication Date: 2018-06-12
SHIBAURA MECHATRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] However, in the substrate processing apparatus described above, if the processing liquid is not completely discharged from the substrate surface and the processing liquid remains on the substrate surface, the processing uniformity of the substrate surface (for example, processing uniformity of etching processing or rinsing processing, etc.) deteriorates. , or, stains such as smudges or stains are generated, so poor handling occurs
In addition, the processing liquid may be excessively supplied, and the consumption of the processing liquid may increase.

Method used

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  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method
  • Substrate processing apparatus and substrate processing method

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Embodiment Construction

[0011] An embodiment will be described with reference to the drawings.

[0012] Such as figure 1 As shown, a substrate processing apparatus 1 according to an embodiment includes a processing box 2 as a processing chamber, a cup 3 provided in the processing box 2, and a support for supporting a substrate W in a horizontal state in the cup 3 Section 4, a rotating mechanism 5 that rotates the support section 4 in a horizontal plane, a liquid supply section 6 that supplies processing liquid to the surface of the substrate W on the support section 4, and a temperature detection that detects the surface temperature of the substrate W when the processing liquid is supplied The part 7, the support mechanism 8 supporting the temperature detection part 7, the temperature monitoring part 9 which monitors the temperature of the substrate W at the time of processing liquid supply, the notification part 10 which notifies process failure, and the control part 11 which controls each part.

[0013]...

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Abstract

Provided are a substrate processing apparatus and a substrate processing method capable of suppressing processing defects and reducing consumption of a processing liquid. The substrate processing apparatus (1) of the embodiment is provided with: a liquid supply part (6), which supplies the processing liquid to the surface of the substrate (W); The surface temperature of the substrate (W); the temperature monitoring unit (9) judges whether the surface temperature detected by the temperature detection unit (7) has reached a prescribed temperature; ) determines that the surface temperature has reached a predetermined temperature, causing the supply unit (6) to stop the supply of the processing liquid.

Description

Technical field [0001] The embodiment of the present invention relates to a substrate processing apparatus and a substrate processing method. Background technique [0002] A substrate processing apparatus is an apparatus that supplies a processing liquid (for example, an etching liquid or a rinse liquid, etc.) to the surface of a substrate such as a wafer or a liquid crystal panel in the manufacturing process of a semiconductor or liquid crystal panel, and processes the surface of the substrate. This substrate processing apparatus has developed an apparatus that rotates the substrate in a horizontal state, supplies a processing liquid from a nozzle to approximately the center of the substrate surface, and performs spin processing in which the processing liquid is diffused to the substrate surface by the centrifugal force of the rotation. [0003] However, in the above-mentioned substrate processing apparatus, if the processing liquid is not completely discharged from the substrate ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/67H01L21/66H01L21/02
CPCH01L21/67017H01L21/6715H01L21/67248H01L22/30H01L21/67051H01L21/6708B08B3/08
Inventor 大田垣崇林航之介桧森洋辅
Owner SHIBAURA MECHATRONICS CORP