Substrate provided with metal layer and manufacturing method of substrate

Abstract

The invention discloses a manufacturing method of a substrate provided with a metal layer. The method comprises steps as follows: S1, partition lines are formed on a first metal film bonded to a first insulation film substrate through cutting, and a partition zone is formed between every two adjacent partition lines and comprises a first partition zone and a second partition zone; S2, metal film strips on the partition zones are separated from the first metal film, the substrate provided with the metal layer is formed and comprises first metal circuit units, each first partition zone is located on one side of the corresponding first metal circuit unit, and each second partition zone is located in the corresponding first metal circuit unit and communicated with the corresponding first partition zone. The production efficiency of the substrate provided with the metal layer is greatly improved, and the substrate provided with the metal layer is particularly applicable to LED lamp strips.

Description

【Technical field】 [0001] The invention relates to a substrate with a metal layer and a manufacturing method thereof. 【Background technique】 [0002] LED is a light-emitting diode, a new technology developed in the middle of the 20th century. [0003] At present, LED light strips generally use LEDs to be assembled on a strip-shaped FPC (flexible circuit board) or LED wiring board. However, the production process of the currently known traditional etching ink flexible circuit board needs to go through cutting, drilling, wiring, exposure, green oil, etching, printing, electrical measurement, etc. The production process is complicated and the cost is very high. The production process that pollutes the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and the production efficiency of splicing and cutting is extremely low, about 3 meters per minute. [0004] The other process wire plate is similar to traditional cables in the pro...

AI Technical Summary

Problems solved by technology

However, the production process of the known traditional etching ink flexible circuit boards needs to go through board cutting, drilling, wiring, exposure, green oil, etching, printing, electrical testing, etc. The production process is complicated and the cost is high.

The production process that pollutes the environment such as electroplating, etching, pickling and drilling is not environmentally friendly, and requires splicing and cutting. The production efficiency is extremely low, and the production rate is about 3 meters per minute.

[0004] The other process wire plate is similar to traditional cables in the production process. Although it does not need electroplating, etching, pickling and drilling processes, it needs to press flat copper strips and then press for production. The production process is expensive. The accuracy is poor, the production capacity is extremely low (0.8 meters per minute for the metal stamping die), and the process is unstable. The copper wire is easy to shift. Risk of conduction due to breakdown

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