A multi-cascade thermoelectric device and its manufacturing method

Abstract

A multi-cascade thermoelectric device, including a packaging sleeve and a power generation unit. The upper and lower ends of the power generation unit are provided with conductive wiring ceramic substrates; the power generation unit is composed of P-type and N-type multi-cascade thermoelectric arms arranged alternately. The thermoelectric arms have more than two thermoelectric columns suitable for various temperature conditions and are connected sequentially through the thermal shielding layer. The low-temperature ends of the two multi-cascade thermoelectric arms are connected to the conductive wiring by brazing, and the two multi-cascade thermoelectric arms The high-temperature end of the high-temperature end is mechanically matched with the conductive wiring through a flexible conductive material. The connection of the conductive wiring corresponding to the high-temperature end is milled with grooves, and filled with flake graphite and ring pads in sequence, and the high-temperature end is put into the ring pad. And in contact with flake graphite. The thermoelectric device and its manufacturing method adopt a mechanical contact method for heat conduction, and realize positioning and flexible fixing through flexible conductive graphite, which not only eliminates thermal mismatch stress, but also avoids damage to materials. In addition, the processing materials of the device are relatively cheap, which reduces the production cost.

Description

technical field [0001] The invention relates to a multi-cascade thermoelectric device and a manufacturing method thereof, belonging to the field of thermoelectric devices. Background technique [0002] Thermoelectric devices refer to a type of electronic components that can directly realize the mutual conversion of electric energy and thermal energy. Its core is a thermoelectric module composed of multiple groups of thermoelectric materials with different carrier types connected in series and parallel. The overall structure of the thermoelectric module is as follows figure 1 shown. [0003] The application of thermoelectric devices has a history of more than one hundred years. In the early days, they were mainly used to detect temperature, such as thermocouples. Later, with the development of high-performance thermoelectric materials, they were used in electronic temperature control, waste heat power generation and aerospace battery packs and other fields. In the past 20 ...

AI Technical Summary

Problems solved by technology

In addition, the temperature of integrated sintering is also difficult to meet the optimal sintering requirements of two thermoelectric materials in different temperature zones.

In addition, the traditional method is complicated and expensive

Due to the challenges of the sintering process, resulting in low product economic efficiency, low yield and high defects

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